某车载毫米波雷达组件热设计与参数优化  

Thermal Design and Parameter Optimization of a Vehicle-borne Millimeter-wave Radar Module

作　　者：杨洪伦 彭伟[2] 洪大良[2] 程仕祥 周围 YANG Honglun;PENG Wei;HONG Daliang;CHENG Shixiang;ZHOU Wei(Deep Space Exploration,Hefei 230088,China;The 38th Research Institute of CETC,Hefei 230088,China)

机构地区：[1]深空探测实验室,安徽合肥230088 [2]中国电子科技集团公司第三十八研究所,安徽合肥230088

出　　处：《电子机械工程》2023年第1期40-43,共4页Electro-Mechanical Engineering

摘　　要：为实现毫米波雷达组件高效可靠的散热,根据前端电讯热控需求,文中提出均温板–翅片一体化风冷热控结构设计方案,并采用仿真设计软件对热设计方案进行了分析和仿真优化。研究结果显示:组件各芯片温度均在安全温度以下,发射芯片的最高结温(最高温度)为141.1℃,与传统风冷散热器相比,采用新型风冷散热器可使芯片最高温度降低9.8℃,强化散热效果明显。此外,也对风冷散热器结构参数和界面接触热阻进行了分析,确定均温板翅片高度30 mm、翅片间距3 mm为该热设计的优选方案。该研究结果可供高效风冷散热和毫米波组件热设计工程应用参考。For efficient and reliable heat dissipation of millimeter-wave radar modules, according to the thermal control requirements of radar module, the integrated thermal control structure design of the uniform temperature plate and air-cooled heat sink is proposed. The thermal design software is employed to analyze and optimize the thermal design structure of the radar module. The research results show that the temperatures of the module chips are below the safe temperature and the maximum junction temperature of the emitter chip(the maximum temperature) is 141.1℃. Compared with the traditional air-cooled heat sink, the novel integrated air-cooled heat sink can reduce the maximum temperature of the chip by 9.8℃. In addition, the structural parameters and interface contact thermal resistance of the air-cooled heat sink are analyzed. It is determined that the optimal thermal design scheme is 30 mm fin height of uniform temperature plate and 3 mm fin spacing. This research results provide a reference for engineering application of high efficiency air-cooled heat dissipation and millimeter-wave module thermal design.

关 键 词：毫米波雷达 风冷散热器 均温板 热设计 

分 类 号：TK124[动力工程及工程热物理—工程热物理]