风冷翅片式热管散热器的性能仿真与应用研究  

Performance Simulation and Application Study of Air-cooled Finned Heat Pipe Heat Sink

作　　者：汪学李 刘肖 刘晔 宋鲜霞 晏刚[1] 马洪奎 Wang Xueli;Liu Xiao;Liu Ye;Song Xianxia;Yan Gang;Ma Hongkui(School of Energy and Power Engineering,Xi'an Jiaotong University,Xi'an,710049,China;Qingdao Hiron Commercial Cold Chain Co.Ltd.,Qingdao,266114,China;Xi'an Huawei Technology Co.Ltd.,Xi'an,710010,China)

机构地区：[1]西安交通大学能源与动力工程学院,西安710049 [2]青岛海容商用冷链股份有限公司,青岛266114 [3]西安华为技术有限公司,西安710010

出　　处：《冷藏技术》2022年第4期56-60,共5页Journal of Refrigeration Technology

基　　金：青岛西海岸新区2020年度科技项目:自主创新重大专项(2020-14)。

摘　　要：热端散热器的性能直接影响着半导体制冷系统的制冷能力。本文通过建立数值仿真模型,开展了风冷翅片式热管散热器的模拟仿真分析研究,得到了散热器内热管、铜板和翅片的温度分布规律,并与实验结果进行了对比分析。参照半导体冷柜实际运行参数,利用集中参数法建立了半导体制冷模块和冷冻柜柜体仿真模型,分析了采用风冷翅片式热管散热器的半导体冷冻柜性能,获得了冷冻柜平均温度和制冷量随时间的变化特性。结果表明,热管散热器温度仿真数值和实验数据的绝对误差在1.7℃以内;稳态仿真结果所示冷柜制冷量与实验测量值的相对误差为7.5%,半导体冷冻柜的动态仿真模型能准确描述半导体冷冻柜的动态特性。The performance of the heat sink at the hot end of a semiconductor refrigeration chip significantly affects the cooling capacity of the refrigeration system. In this paper, a numerical simulation model of heat pipe heat sink is established, and the temperature distribution of heat pipe, copper plate and fins inside the heat sink is obtained and compared with the experimental results. Combined with the actual semiconductor freezer, the semiconductor refrigeration module and the freezer cabinet model is established using the centralized parameter method. The characteristics of the average temperature in cabinet and cooling capacity with time are investigated and obtained. The results show that the absolute error between the heat pipe radiator temperature values and the experimental results is within 1.7 ℃;the relative error between the refrigeration capacity of the freezer shown in the steadystate simulation results and the experimental measurements is 7.5%,The simulation model could accurately describe the dynamic characteristic of the semiconductor refrigerated cabinets.

关 键 词：热管散热器 半导体制冷 冷冻柜 系统仿真 

分 类 号：TK172[动力工程及工程热物理—热能工程]