单侧内肋阵微通道复合热沉构形优化设计及遗传算法比较分析  

Constructal optimization design of hybrid microchannel heat sink with single-sided internal fin array and comparative study of genetic algorithms

作　　者：陆卓群 谢志辉[1] 吴锋[3,4] 刘海力 王蓉 南刚 LU Zhuoqun;XIE Zhihui;WU Feng;LIU Haili;WANG Rong;NAN Gang(College of Power Engineering,Naval University of Engineering,Wuhan 430033,China;School of Energy,Mechanical&Electronic Engineering,Hunan University of Humanities,Science and Technology,Loudi 417000,China;School of Optical Information and Energy Engineering,Wuhan Institute of Technology,Wuhan 430205,China;Institute of Thermal Science and Power Engineering,Wuhan Institute of Technology,Wuhan 430205,China;Yichang Testing Technology Research Institute,Yichang 443003,China)

机构地区：[1]海军工程大学动力工程学院,湖北武汉430033 [2]湖南人文科技学院能源与机电工程学院,湖南娄底417000 [3]武汉工程大学光电信息与能源工程学院,湖北武汉430205 [4]武汉工程大学热科学与动力工程研究所,湖北武汉430205 [5]宜昌测试技术研究所,湖北宜昌443003

出　　处：《中国舰船研究》2023年第1期247-259,共13页Chinese Journal of Ship Research

基　　金：国家自然科学基金资助项目(51979278,51579244,51506220)。

摘　　要：[目的]旨在通过构形优化设计提高电子设备的热管理技术水平。[方法]在约束肋片体积占比和相对位置的条件下,建立微通道复合热沉的三维流动和传热数值模型,以热沉固体区域温度梯度均匀性因子最小化为目标,分别采用穷举法和遗传算法对肋片高宽比h/w及肋片间距ε进行构形优化设计。[结果]结果显示,采用穷举法和遗传算法均能得到热沉固体区域温度梯度均匀性因子的最小值以及对应的最优构形,且温度梯度均匀性相比无肋微通道热沉,最高可提高13.30%;采用穷举法和10种配置遗传算法方案所得目标函数最小值之间的误差最大不超过0.92%。[结论]所做研究可为电子设备散热器的研发提供新的优化设计结果。[Objectives]This study seeks to improve the thermal management technology of electronic devices through constructal optimization design.[Methods]First,the 3D flow and heat transfer numerical model of a hybrid microchannel heat sink is established,and the volume ratio and relative position of its single-sided internal fins are fixed.Constructal optimization is then performed,for which the height-to-width ratio h/w and spacing distribution of finsεare taken as the design variables,and the minimization of the temperature gradient uniformity factor in the solid region of the heat sink is taken as the objective.The exhaustive method and genetic algorithm are subsequently performed.[Results]The results show that both the exhaustive method and genetic algorithm can find the minimum value of the temperature gradient uniformity factor and corresponding optimal construct,and the temperature gradient uniformity is improved by up to 13.30%compared to that of the finless microchannel heat sink.The relative difference in the obtained minimum objective function value between the exhaustive method and ten genetic algorithm schemes is no more than 0.92%.[Conclusions]This study provides new optimization design results for the research and development of heat sinks for electronic devices.

关 键 词：构形理论 遗传算法 电子器件冷却 微通道热沉 热设计 

分 类 号：U664.53[交通运输工程—船舶及航道工程]