高填材料基材钻孔能力优化  

Optimization of drilling capacity of high fill material substrate

作　　者：周尚松 司明智 廖志鹏 ZHOU Shangsong;SI Mingzhi;LIAO Zhipeng(Shennan Circuit Co.,Ltd.,Shenzhen 518117,Guangdong,China)

机构地区：[1]深南电路股份有限公司,广东深圳518117

出　　处：《印制电路信息》2023年第2期30-36,共7页Printed Circuit Information

摘　　要：某高填材料基材现有的钻孔加工能力无法满足产品的设计需求,加工过程中常出现断钻、孔损、层间分离等质量问题,为此进行设计优化,采用新型涂层钻头。优化后可以满足该高填材料厚径比为12∶1的产品,钻孔报废率从25%降低至0.95%,解决了高填材料高厚径比的质量问题。Since one type of the base material has high fill material, the existing drilling processing capacity cannot meet the customer’s product design requirements. There are often quality risks such as broken drills, hole damage or layer separation. Therefore, the author has designed a new type of coated drill, which can meet the requirements of improving the thickness-diameter ratio of the fill material to 12:1, and the drilling scrap rate is reduced from 25% to 0.95%,and can solve the quality problem of high aspect ratio of high filler materials.

关 键 词：高填料基材 钻孔能力 新型涂层钻头 高厚径比 

分 类 号：TN41[电子电信—微电子学与固体电子学]