用于大气数据系统的硅谐振压力传感器  

Silicon resonant pressure sensor for airborne atmospheric data system

作　　者：胡宗达 彭鹏 李奇思 杨劼立 苏晓晓 HU Zongda;PENG Peng;LI Qisi;YANG Jieli;SU Xiaoxiao(Advanced Research Center,AVIC Chengdu Caic Electronics Co Ltd,Chengdu 610091,China;Sensors Division,AVIC Chengdu Caic Electronics Co Ltd,Chengdu 610091,China)

机构地区：[1]航空工业成都凯天电子股份有限公司预研中心,四川成都610091 [2]航空工业成都凯天电子股份有限公司传感器事业部,四川成都610091

出　　处：《传感器与微系统》2023年第3期160-163,共4页Transducer and Microsystem Technologies

摘　　要：设计了一种用于机载大气数据系统的高精度微机电系统(MEMS)硅谐振压力传感器。采用了多层硅—硅键合技术、阳极键合技术以获得高稳定性的频率信号输出和圆片级真空封装,其具有高精度、高Q值的特点。芯片采用复合谐振梁—膜—硅岛结构作为谐振器部分,以减小面外谐振模态带来的性能影响。测试结果表明:在量程范围为3~130 kPa,温度范围为-55~85℃,该谐振压力传感器的全温全压精度高达0.01%FS。A high precision micro-electro-mechanical system(MEMS)silicon resonant pressure sensor for atmospheric data system is designed. Multilayer silicon-silicon bonding technology and anodic bonding technology are used to obtain high stability of frequency signal output and wafer level vacuum package, which has the characteristics of high precision and high Q value.The composite resonant beam-membrane-silicon island structure is used as the resonator to reduce the influence of out-of-plane resonant modes.The test results show that in the measuring range of 3~130 kPa, temperature range of-55~85 ℃,the precision of the resonant pressure sensor is up to 0.01 %FS in range of full temperature and full pressure.

关 键 词：硅谐振压力传感器 复合谐振梁—膜—硅岛结构 高精度 微机电系统 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]