PEK-CN/SiC复合材料的制备及热学性能  

Preparation and Thermal Properties of PEK-CN/SiC Composites

作　　者：王元泽 曲敏杰 杨淑军 刘静 孔令曜 周光远 Wang Yuanze;Qu Minjie;Yang Shujun;Liu Jing;Kong Lingyao;Zhou Guangyuan(School of Textile and Material Engineering,Dalian Polytechnic University,Dalian,Liaoning,116034;Dalian Institute of Chemical Physics,Chinese Academy of Sciences,Dalian,Liaoning,116023)

机构地区：[1]大连工业大学纺织与材料工程学院,辽宁大连116034 [2]中国科学院大连化学物理研究所,辽宁大连116023

出　　处：《现代塑料加工应用》2023年第1期9-12,共4页Modern Plastics Processing and Applications

基　　金：辽宁省教育厅自然科学基金项目(J2020007)。

摘　　要：以酚酞聚芳醚腈酮(PEK-CN)为基体、碳化硅(SiC)为导热填料,用硅烷偶联剂(KH550,KH560及KH570)对SiC进行表面改性,通过静电纺丝技术和高温模压法制备了PEK-CN/SiC复合材料,研究了SiC含量和不同偶联剂改性SiC对PEK-CN/SiC薄膜的微观形貌、PEK-CN/SiC复合材料的导热性能和热稳定性的影响。结果表明:偶联剂改性SiC后以及随着SiC含量的增加,PEK-CN/SiC复合材料的导热性能与热稳定性均有所改善。当经KH560表面改性的SiC质量分数为25%时,复合材料的导热系数最大,达到了0.586 W/(m·K),比PEK-CN导热系数提高了133.5%,玻璃化转变温度、失重5%及30%时的温度较PEK-CN分别提升了3.79,0.37,225.76℃。Using phenolphthalein poly(aryl ether nitrile ketone)(PEK-CN) as matrix, silicon carbide(SiC) as thermal conductivity filler and the surface of SiC was modified with silane coupling agent(KH550, KH560 and KH570). PEK-CN/SiC composites were prepared by electrospinning and high temperature molding. The effects of SiC content and SiC modified by different coupling agent on the microstructure of PEK-CN/SiC films, the thermal conductivity and thermal stability of PEK-CN/SiC composites were studied. The results show that after SiC is modified by coupling agent and with the increase of SiC content, the thermal conductivity and thermal stability of PEK-CN/SiC composites are improved. When the mass fraction of SiC modified by KH560 is 25%, the thermal conductivity of the composites is the highest 0.586 W/(m·K), which is 133.5% higher than that of PEK-CN, and the glass transition temperature, the temperature at 5% and 30% weight loss are 3.79, 0.37,225.76 ℃ higher than those of PEK-CN, respectively.

关 键 词：酚酞聚芳醚腈酮 碳化硅 静电纺丝 热学性能 

分 类 号：TB332[一般工业技术—材料科学与工程]