FCBGA封装的CPU芯片散热性能影响因素研究  

Research on factors of heat dissipation of CPU chips in FCBGA package

作　　者：陈彪 陈才 张坤 叶琴 CHEN Biao;CHEN Cai;ZHANG Kun;YE Qin(Phytium Technology(Changsha)Co.,Ltd.,Changsha 410008,China)

机构地区：[1]飞腾技术(长沙)有限公司,湖南长沙410008

出　　处：《计算机工程与科学》2023年第3期406-410,共5页Computer Engineering & Science

摘　　要：散热设计是芯片封装设计中非常重要的一环,直接影响芯片运行时的温度和可靠性。芯片内部封装材料的尺寸参数和物理特性对芯片散热有较大影响,可以用芯片热阻或结温的高低来衡量其散热性能的好坏。通过数值模拟(有限体积法)的方法,对某国产FCBGA封装的CPU散热性能进行研究,分析CPU封装内的各层材料尺寸、导热系数及功率密度等因素对CPU温度和热阻的影响。研究结果表明:TIM1导热系数在35 W/(m·K)以内时,TIM1导热系数和厚度对CPU散热有较大影响;晶圆面积(功率密度)对CPU散热有较大影响,晶圆厚度对CPU散热影响不大。Thermal design is a very important part of chip packaging design,which directly affects the temperature and reliability of the chip during operation.The size parameters and physical properties of the packaging materials inside the chip have great influence on the heat dissipation of the chip.The thermal resistance of the chip or the junction temperature can be used to measure the heat dissipation performance.This paper studies the heat dissipation performance of some domestic FCBGA package by numerical simulation(Finite Volume Method),and analyzes the influence of factors such as material size,thermal conductivity of each layer in the CPU package and power density on the CPU temperature and thermal resistance.The research results show that,when the thermal conductivity of TIM1 is lower than 35 W/(m·K),the thermal conductivity and thickness of TIM1 have great influence on the heat dissipation of the CPU;the die area(power density)has great influence on the heat dissipation of the CPU,and the thickness of the die has little effect.

关 键 词：FCBGA 导热系数 界面材料 晶圆 功率密度 

分 类 号：TK12[动力工程及工程热物理—工程热物理]