银粉对片式电阻器用电阻功能浆料的影响  

Effect of Silver Powder Particle on Resistive Functional Paste for Chip Resistors

作　　者：张帅 周宝荣 吴高鹏 马小强 王鹏 Zhang Shuai;Zhou Baorong;Wu Gaopeng;Ma Xiaoqiang;Wang Peng(Xi'an Hongxing Electronic Paste Co.,Ltd.,Xi'an,China)

机构地区：[1]西安宏星电子浆料科技股份有限公司,陕西西安

出　　处：《科学技术创新》2023年第5期43-46,共4页Scientific and Technological Innovation

摘　　要：在相同配方中填充不同粒径的球形银粉制成片式电阻器用电阻功能浆料,通过对比烧结膜宏观烧结表面、微观形貌及浆料电性能,研究银粉粒径对电阻浆料烧结膜层结构和电性能的影响。结果表明:在粒径(D50)在0.9~1.9μm内,银粉的粒径越小,电阻浆料的烧结膜层的细孔和贯穿式孔洞越少,膜层越均一和致密,其抗静电放电ESD性能越好,同时银粉的粒径大小对方阻和温度系数的影响较小。The same formula is filled with spherical silver powder of different particle sizes to make resistive functional paste for chip resistors.By comparing the macroscopic sintered surface of the sintered film,the microscopic morphology and the electrical properties of the paste,the effect of silver powder particle size on the resistance paste is studied.The effect of material sintered film layer structure and electrical properties.The results show that: within the particle size(D50) of 0.9~1.9 μm,the smaller the particle size of the silver powder,the fewer pores and penetrating holes in the sintered film layer of the resistance paste,the more uniform and dense the film layer,and the better the anti-static discharge performance.Meanwhile,the particle size of silver powder has little effect on the resistance and temperature coefficien.

关 键 词：电阻浆料 粒径 烧结表面 孔洞 电性能 

分 类 号：TM214[一般工业技术—材料科学与工程]