基于阳极键合的玻璃与Kovar合金连接  

Connection of Glass and Kovar Alloy Based on Anodic Bonding

作　　者：庞子明 胡利方[1] 贾旭 韩伟韬 李子昊 PANG Ziming;HU Lifang;JIA Xu;HAN Weitao;LI Zihao(School of Materials Science and Engineering,Taiyuan University of Technology,Taiyuan 030024,China)

机构地区：[1]太原理工大学材料科学与工程学院,山西太原030024

出　　处：《热加工工艺》2023年第1期119-122,共4页Hot Working Technology

摘　　要：利用阳极键合成功实现了Borofloat33(BF33)玻璃与Kovar合金的连接。键合电流变化表明,键合过程中,电流先快速增大到峰值,之后呈指数式下降,且键合电流峰值随着键合温度与电压的升高而增大。利用扫描电子显微镜(SEM)对Glass-Kovar界面进行微观形貌观察,键合界面良好,在500℃/1000 V的条件下,Glass-Kovar界面处Na+耗尽层的厚度约为100 nm。室温拉伸试验表明,样品的剪切强度随着键合温度与电压的升高而增大,且断裂总是发生在玻璃基体上。Anodic bonding was used to successfully realize the connection between Borofloat33(BF33) glass and Kovar alloy. The bonding current change shows that during bonding process the current rapidly increases to the peak value,and then decreases exponentially, and the peak value of the bonding current increases with the increase of the bonding temperature and voltage. Scanning electron microscope(SEM) was used to observe the micromorphology of the Glass-Kovar interface. It is found that the bonding interface is good. Under the condition of 500 ℃/1000 V, the thickness of the Na+depletion layer at the Glass-Kovar interface is about 100 nm. The tensile test at ambient temperature shows that the shear strength of the sample increases with the increase of the bonding temperature and voltage, and the fracture always occurs at the glass substrate.

关 键 词：BF33玻璃 Kovar合金 阳极键合 Na+耗尽层 

分 类 号：TG496[金属学及工艺—焊接] TB333.11[一般工业技术—材料科学与工程]