同轴馈电微带相控阵天线集成技术  

Array integration technology of coaxial feed microstrip phased array antenna

作　　者：万录明 WAN Luming(No.10 Reasearch Institute of China Electronic Technology Group Coorporation,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第十研究所,四川成都610036

出　　处：《现代电子技术》2023年第7期14-17,共4页Modern Electronics Technique

摘　　要：以某毫米波同轴馈电微带相控阵天线为例,介绍了微带天线阵面的结构组成,分析了其工艺特点并指出工艺实现的难点。提出了微带天线阵面集成工艺方案,包含微带与金属底板层压技术、阵列SMP连接器焊接技术和集成效果检测技术。通过工艺试验结果验证表明,采用的集成工艺方案生产的同轴馈电微带相控阵天线阵面层压与焊接质量良好,空洞率指标、层压抗脱落强度和焊接强度均满足设计要求,能应用于实际同轴馈电微带相控阵天线阵面生产。By taking a millimeter⁃wave coaxial feed microstrip phased⁃array antenna as an example,the structure and composition of the microstrip antenna array are introduced,its process characteristics are analyzed and the difficulties of process realization are pointed out.An integrated process scheme of the microstrip antenna array is proposed,including the microstrip and metal substrate lamination technology,array SMP connector welding technique and integration effect detection technology.The verification of the process test results show that the array lamination and welding quality of coaxial feed microstrip phased⁃array antenna produced by the integrated process scheme are all right,and the void ratio index,lamination anti⁃shedding strength and welding strength can meet the design requirements.It can be applied to the production of actual coaxial feed microstrip phased⁃array antenna array.

关 键 词：同轴馈电 微带相控阵天线 集成工艺 层压工艺 焊接工艺 实验验证 

分 类 号：TN828-34[电子电信—信息与通信工程] TG454[金属学及工艺—焊接]