QFN器件组装工艺缺陷分析及预防措施  

Defect Analysis of Assembly Process and Preventive Measures for QFN Device

作　　者：毛久兵 邴继兵 黎全英 高燕青 胡筝 张润华 张红兵 MAO Jiubing;BING Jibing;LI Quanying;GAO Yanqing;HU Zheng;ZHANG Runhua;ZHANG Hongbing(The 30th Research Institute of CETC,Chengdu 611730,China)

机构地区：[1]中国电科技集团公司第三十研究所,成都611730

出　　处：《电子工艺技术》2023年第2期17-19,36,共4页Electronics Process Technology

基　　金：国家重点研发计划项目(2021YFB3302104)。

摘　　要：QFN器件在组装过程中容易出现信号焊盘桥连、散热焊盘空洞和侧面焊点爬锡高度不足等工艺缺陷。分析了缺陷形成机理,并从PCB焊盘设计、焊膏印刷模板设计提出了有效预防措施。QFN devices are prone to process defects such as bridging of signal solder,voids in heat dissipation solder and insuffi cient tin climbing height of side solder joints during the assembly process.The formation mechanism of defects are analyzed,and effective preventive measures are proposed form two aspects of PCB land pattern design and solder paste printing stencil design.

关 键 词：QFN 桥连 空洞 电子组装 

分 类 号：TN605[电子电信—电路与系统]