自防护复合焊膏在微系统T/R组件封装中的应用  

Application of Self-protective Resin-based Solder Paste in Microsystem T/R Module Packaging

作　　者：王禾 周健[2] 汪锐[1] 张丽 陈晓雨 WANG He;ZHOU Jian;WANG Rui;ZHANG Li;CHEN Xiaoyu(The 38th Research Institute of CETC,Hefei 230031,China;College of Materials Science and Engineering,Southeast University,Nanjing 211189,China)

机构地区：[1]中国电子科技集团公司第三十八研究所,合肥230031 [2]东南大学材料科学与工程学院,南京211189

出　　处：《电子工艺技术》2023年第2期20-22,40,共4页Electronics Process Technology

基　　金：38所创新课题项目的支持

摘　　要：微系统封装由于极大提升了整个系统的功能与性能,已经逐步成为T/R组件最为重要的封装方式。航空、航天、军事、汽车等领域中的雷达等电子产品均对轻小型微系统T/R组件有着迫切的需求,但是目前微系统T/R组件常采用的低温/高温共烧陶瓷电路基板,与电装复合介质电路板之间的热膨胀系数失配度较大,极易造成中间连接的焊球(柱)焊点界面开裂,进一步造成整个系统的失效。针对HTCC基板与电路基板之间焊球的封装失效现象进行了研究,提出了一种复合添加环氧树脂制备自防护焊膏进行封装的工艺新方法,观察了封装界面的组织形貌并记录了焊点力学性能的演化规律,归纳并总结自防护焊膏提升可靠性的机理,为加速T/R组件微系统化的进一步落地提供了借鉴和指导。Microsystem packaging technology can vastly improve the function and performance of the whole system,which gradually becomes the most important packaging method for T/R modules.There is a desperate need for small microsystem T/R module in the areas of aeronautics and astronautics,the same as military and automotive electronics.However,there exists a relatively large gap between the coeffi cient of thermal expansion of HTCC/LTCC and composite copper-clad circuit board,which can cause cracking behavior at the interface of solder joints,leading to the further failure of all the microsystem.Thus,this phenomenon in microsystem has been investigated.A new packaging method of self-protective resinbased solder paste has been put forward for the fi rst time in the electronic industry,the microstructure of the packaging interface is observed and the evolution law of the mechanical properties of the solder joint is recorded,the mechanism of improving the reliability of the self-protective solder paste is summarized,which provides reference and guidance for further implementation of T/R component microsystematization.

关 键 词：自防护复合焊膏 微系统封装 T/R组件 可靠性 

分 类 号：TN605[电子电信—电路与系统]