印制板组件回流焊表面温度场的建模仿真技术  

Modeling and Simulation of Temperature Field on Solder Joints of Printed Board Assembly

作　　者：陈帅 赵文忠[1] 金星 CHEN Shuai;ZHAO Wenzhong;JIN Xing(The 20th Research Institute of CETC,Xi’an 710071,China)

机构地区：[1]中国电子科技集团公司第二十研究所,西安710071

出　　处：《电子工艺技术》2023年第2期23-26,32,共5页Electronics Process Technology

摘　　要：采用有限元分析方法,基于材料实际参数建立印制板组件的三维模型。对照回流炉实际温度设置方式,通过研究炉体结构、加热方式和空气流动,然后以传热学中的射流模型估算得到的对流系数值作为有限元模型的边界条件,通过模拟仿真得出组件表面各个位置在再流焊过程中的温度变化情况和温度场的分布情况。在印制板组件表面设置测温点,测量实际回流曲线,与模拟仿真结果进行对比,验证了仿真的有效性。The 3D model of printed board assembly is established based on the actual material parameters by using the finite element analysis method.According to the actual temperature setting mode of reflow furnace,by studying the furnace structure,heating mode and air flow pattern,the convection coefficient estimated by the jet model in heat transfer is used as the boundary condition of the element model.Through simulation,the distribution of temperature field of the printed board assembly is obtained.Temperature measuring points are set on the surface of printed board assembly to measure the actual reflow temperature curve.Compared to the experimental result,the effectiveness of the simulation is verified.

关 键 词：回流焊 温度仿真 有限元 

分 类 号：TN605[电子电信—电路与系统]