引线键合尾丝控制分析及解决方法  

Analysis and Solution on Control of Wire Bonding Tail Wire

作　　者：马生生 侯一雪 郝艳鹏 邹森 MA Shengsheng;HOU Yixue;HAO Yanpeng;ZOU Sen(The 2nd Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,太原030024

出　　处：《电子工艺技术》2023年第2期37-40,共4页Electronics Process Technology

摘　　要：引线键合技术是微电子元器件封装工艺流程中的关键工序,是后道封装工艺中电气互连的主要工艺手段。针对高密度精密键合工艺要求,通过全自动引线键合机的送丝机构、键合劈刀结构、焊接参数和断丝工艺参数等四个方面进行尾丝的形成分析,并在全自动引线键合机上进行楔形键合,最终得到形貌良好的键合焊点。Wire bonding is the key process part of microassembly technology.It is the main technical means of electrical interconnection in the packaging process.For high density precision bonding process requirements,the tail wire formation of wire feed mechanism,bonding wedge structure,soldering parameters and wire breaking process parameters of fully automatic wire bonder is analyzed.And the wedge bonding is carried out on the fully automatic wire bonder to obtain a bonding spot with good shape.

关 键 词：引线键合 楔形键合 尾丝控制 全自动引线键合机 

分 类 号：TN605[电子电信—电路与系统]