Digital-intensive RFIC design techniques for transmitters in ISSCC 2023  

作　　者：Yun Yin Hongtao Xu 

机构地区：[1]State Key Laboratory of Integrated Chips and Systems,Department of Microelectronics,Fudan University,Shanghai 201203,China

出　　处：《Journal of Semiconductors》2023年第4期8-9,共2页半导体学报（英文版）

摘　　要：Sub-6 GHz multi-standard wireless communication and millimeter-wave(mm-wave)wireless transmission provide users with multi-functionality and unprecedented wireless connectivity.With CMOS process scaling down,system-on-chip(SoC)implementation of wireless systems along with RFIC functionality is highly desirable for low cost and small form-factor.The digital transceiver architecture aligns with Moore’s law to provide compact die area,better interface to digital backend and higher efficiency due to the faster switching nature of core devices[1−28].

关 键 词：RFIC ISSCC MILLIMETER 

分 类 号：TN830[电子电信—信息与通信工程]