云南高校图书馆联盟文献共享服务平台- ISSCC

ISSCC: 作品数：70被引量：6H指数：1; 导出分析报告; 相关领域：电子电信自动化与计算机技术更多>>; 相关作者：李文石菊池隆裕王志华陈颖莹林咏更多>>; 相关机构：苏州大学清华大学中华人民共和国工业和信息化部北京市科学技术研究院更多>>; 相关期刊：《河南科技》《集成电路应用》《微纳电子与智能制造》《电信交换》更多>>; 相关基金：国家自然科学基金江苏省高校自然科学研究项目更多>>

ISSCC 2024论文技术热点分析: 《微纳电子与智能制造》2024年第2期1-31,共31页杨业成王少昊; 国家自然科学基金项目(62474044)资助; 随着新一轮科技革命和产业变革的加速演进,特别是5G、人工智能、物联网、虚拟现实/增强现实和高性能计算等技术的快速发展,集成电路产业已成为全球技术竞争的焦点。作为集成电路设计领域的顶级国际会议,国际固态电路会议(ISSCC)汇聚了...; 关键词：ISSCC 集成电路研究趋势技术洞察

Towards efficient generative AI and beyond-AI computing:New trends on ISSCC 2024 machine learning accelerators: 《Journal of Semiconductors》2024年第4期12-15,共4页Bohan Yang Jia Chen Fengbin Tu; This research was supported in part by ACCESS-AI Chip Center for Emerging Smart Systems,sponsored by InnoHK funding,Hong Kong SAR,and HKUST-HKUST(GZ)20 for 20 Cross-campus Collaborative Research Scheme C031.; Compared to the last decade when the convolution neu-ral network(CNN)dominated the research field,machine learn-ing(ML)algorithms have reached a pivotal moment called the generative artificial intelligence(AI)era.With...; 关键词：ISSCC BEYOND AI

Millimeter-wave PA design techniques in ISSCC 2024: 《Journal of Semiconductors》2024年第4期16-18,共3页Yun Wang Hongtao Xu; Millimeter-wave systems with high integration level have been rapidly developed to enable modern wireless communication,sensing,and imaging.The millimeter-wave power amplifier(PA)is one of the most challenging and cri...; 关键词：MILLIMETER MILLIMETER ISSCC

ISSCC 2023回声未来十年AMD如何进行效率创新: 《微型计算机》2023年第9期93-98,共6页徐昌宇(文/图); ISSCC(International Solid-State Circuits Conference,国际固态电路会议)是全球学术界和工业界公认的集成电路设计领域最高级别会议,汇集各个时期国际上顶尖集成电路技术的抢先展示和发表,具有广泛的影响力。ISSCC 2023于2月底在美国...; 关键词：集成电路技术 AMD ISSCC Solid 集成电路设计未来十年英特尔主题演讲

The VCOs in ISSCC 2023 set the new performance frontier of silicon-based oscillators: 《Journal of Semiconductors》2023年第5期7-8,共2页Haikun Jia; High-quality frequency generators are one of the fundamental building blocks in high-throughput wireless communication systems.Driven by the fast-growing demand for high data rate communications,the signal generator c...; 关键词：ISSCC tuning WIRELESS

Beyond convolutional neural networks computing:New trends on ISSCC 2023 machine learning chips被引量：1: 《Journal of Semiconductors》2023年第5期9-12,共4页Chen Mu Jiapei Zheng Chixiao Chen; supported by the National Key Research and Development Program of China(No.2022YFB4500100)。; Machine learning(ML)domain specific architectures(DSA)and chips have been prevailed in the past few years.These custom DSA designs outperform conventional general purposed architectures in terms of energy efficiency,p...; 关键词：ISSCC networks NEURAL

Emerging trends of integrated-mixed-signal chips in ISSCC 2023: 《Journal of Semiconductors》2023年第5期13-16,共4页Jinbo Chen Jie Yang Mohamad Sawan; supported by STI2030-Major Projects 2022ZD0208805。; In February 2023,the annual‘Olympic’of the chip industry,ISSCC,returned to in-person meetings in San Francisco.As shown in Fig.1,from the ISSCC 2023,we can see that the trend in IC design has shifted from pure digit...; 关键词：ISSCC signal QUANTUM

CMOS phase-locked loops in ISSCC 2023: 《Journal of Semiconductors》2023年第5期17-18,共2页Zhao Zhang; supported by the National Natural Science Foundation of China(Grant Nos.62222409 and62174153);Beijing Municipal Science and Technology Project(Grant No.Z211100007921019)。; High-performance phase-locked loops(PLL)are widely used in modern system-on chips(So C)including the ultrahigh-speed wireless/wireline communication(e.g.5G/6G transceivers,over-100-Gbps Ser Des transceivers),high reso...; 关键词：ISSCC TRANSCEIVER WIRELESS

CMOS image sensors in ISSCC 2023: 《Journal of Semiconductors》2023年第4期6-7,共2页Peng Feng Nanjian Wu Jian Liu Liyuan Liu; the National Natural Science Foundation of China(62134004);the National Key Research and Development Program of China(2022YFB2804402);Basic Frontier Scientific Research Program of the Chinese Academy of Sciences(ZDBS-LY-JSC008)。; In IEEE International Solid-State Circuits Conference(ISSCC)2023,CMOS process is still the dominating fabrication technology for image sensors,and three-dimensional(3D)wafer-stacked process with Cu–Cu pixel-level con...; 关键词：ISSCC IMAGE PROCESS

Digital-intensive RFIC design techniques for transmitters in ISSCC 2023: 《Journal of Semiconductors》2023年第4期8-9,共2页Yun Yin Hongtao Xu; Sub-6 GHz multi-standard wireless communication and millimeter-wave(mm-wave)wireless transmission provide users with multi-functionality and unprecedented wireless connectivity.With CMOS process scaling down,system-on...; 关键词：RFIC ISSCC MILLIMETER

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