Emerging trends of integrated-mixed-signal chips in ISSCC 2023  

作　　者：Jinbo Chen Jie Yang Mohamad Sawan 

机构地区：[1]CenBRAIN Neurotech,School of Engineering,Westlake University,Hangzhou 310024,China

出　　处：《Journal of Semiconductors》2023年第5期13-16,共4页半导体学报（英文版）

基　　金：supported by STI2030-Major Projects 2022ZD0208805。

摘　　要：In February 2023,the annual‘Olympic’of the chip industry,ISSCC,returned to in-person meetings in San Francisco.As shown in Fig.1,from the ISSCC 2023,we can see that the trend in IC design has shifted from pure digital to mixed-signal design,particularly in areas such as AI accelerator chips and quantum computing.Chips have also evolved from integrated circuits to integrated chips through modulelevel,function-level,and chip-level fusion,with compute-inmemory being the best embodiment of module-level and function-level fusion.Moreover,quantum computing was one of the major focuses of this ISSCC edition,with a separate paper session dedicated to cryo-CMOS for quantum computing.

关 键 词：ISSCC signal QUANTUM 

分 类 号：TN40[电子电信—微电子学与固体电子学] F416.63[经济管理—产业经济]