线锯切片技术及其在碳化硅晶圆加工中的应用  

Wire Saw Slicing and Its Application in Silicon Carbide Wafers Processing

作　　者：张俊然 朱如忠 张玺 张序清[2,3] 高煜 陆赟豪 皮孝东[2,3] 杨德仁 王蓉[2,3] ZHANG Junran;ZHU Ruzhong;ZHANG Xi;ZHANG Xuqing;GAO Yu;LU Yunhao;PI Xiaodong;YANG Deren;WANG Rong(Department of Physics,Zhejiang University,Hangzhou 310027,China;Zhejiang Provincial Key Laboratory of Power Semiconductor Materials and Devices,ZJU-Hangzhou Global Scientific and Technological Innovation Center,Hangzhou 311200,China;State Key Laboratory of Silicon Materials,School of Materials Science and Engineering,Zhejiang University,Hangzhou 310027,China;College of Additive Manufacturing,Zhejiang Institute of Mechanical and Electrical Technology,Hangzhou 310053,China)

机构地区：[1]浙江大学物理学院,杭州310027 [2]浙江大学杭州国际科创中心,先进半导体研究院和浙江省宽禁带功率半导体材料与器件重点实验室,杭州311200 [3]浙江大学材料科学与工程学院,硅材料国家重点实验室,杭州310027 [4]浙江机电职业技术学院增材制造学院,杭州310053

出　　处：《人工晶体学报》2023年第3期365-379,共15页Journal of Synthetic Crystals

基　　金：浙江省“尖兵”“领雁”研发攻关计划(2022C01021);国家自然科学基金(91964107,U20A20209);国家自然科学基金创新研究群体项目(61721005)。

摘　　要：作为制备半导体晶圆的重要工序,线锯切片对半导体晶圆的质量具有至关重要的影响。本文以发展最成熟的硅材料为例,介绍了线锯切片技术的基本理论,特别介绍了线锯切片技术的力学模型和材料去除机理,并讨论了线锯制造技术及切片工艺对材料的影响。在此基础上,综述了线锯切片技术在碳化硅晶圆加工中的应用和技术进展,并分析了线锯切片技术对碳化硅晶体表面质量和损伤层的影响。最后,本文指出了线锯切片技术在碳化硅晶圆加工领域面临的挑战与未来的发展方向。Wire saw slicing technology has become a research hotspot in the field of slicing of brittle-and-hard materials.As an important process in semiconductor wafer processing,wire saw slicing has a crucial impact on the quality of semiconductor wafers.This paper introduces the basic theory and the research progress of wire saw slicing technology,taking the most mature silicon crystal as an example,especially the mechanical model and material removal mechanism of wire saw slicing.Then the influence of wire saw manufacturing technology and slicing process on the material is discussed.Furthermore,silicon carbide is a key material that supports the development of electric cars,clean energy and national defense industry because of its outstanding comprehensive advantages in physical properties,such as wider band gap.In this paper,the application and technological progress of wire saw slicing in silicon carbide wafer processing are reviewed.In addition,the influence of wire saw slicing on the surface quality and damage of silicon carbide crystal is analyzed.Finally,this paper points out the challenges and future development directions of wire saw slicing technology.

关 键 词：线锯切片 硬脆材料 单晶碳化硅 晶圆加工 砂浆线切割 金刚线切割 

分 类 号：O786[理学—晶体学]