基于MEMS的电容式微机械超声换能器曲面阵列的设计与制备  

Design and Fabrication of Capacitive Micromachined Ultrasonic Transducer Curved Array Based on MEMS

作　　者：秦芸 王智豪 杨玉华[1] 何常德[1] 王任鑫[1] Qin Yun;Wang Zhihao;Yang Yuhua;He Changde;Wang Renxin(State Key Laboratory of Dynamic Measurement Technology,North University of China,Taiyuan030051,China)

机构地区：[1]中北大学省部共建动态测试技术国家重点实验室,太原030051

出　　处：《微纳电子技术》2023年第2期272-279,共8页Micronanoelectronic Technology

基　　金：国家自然科学基金资助项目(61927807,51875535,61727806);国家重点研发计划资助项目(2020YFC0122102);山西省基础研究计划资助项目(20210302123027,20210302124203);山西省“1331工程”重点学科建设计划基金资助项目(1331KSC)。

摘　　要：基于先进的微电子机械系统(MEMS)关键技术,研制了一种使用倒装焊技术将电容式微机械超声换能器(CMUT)与柔性印刷电路板(PCB)键合在一起的16×16阵元曲面阵列。为了研发高密度和高一致性的CMUT柱面阵列,设计了CMUT曲面阵列的工艺流程,并进行了制作,制备的CMUT中心频率为3 MHz。然后,对CMUT阵元进行了测试,测试结果表明,电容变化量基本为40~50 pF,且CMUT阵元的收发性能良好。将制作好的CMUT与柔性PCB进行键合,并对其进行划片,再采用聚二甲基硅氧烷(PDMS)填充沟槽,最后粘在曲面模具上溅射金属上电极,制得CMUT曲面阵列。该阵列可在特定方向上弯曲,且曲面阵列的CMUT阵元一致性良好。下一步研究将使曲面阵能够以行列寻址的方式进行发射接收,减少阵元电极的接线数目。Based on the advanced key technologies of micro-electromechanical systems(MEMS),a 16×16 element curved array which consists of a capacitive micromechanical ultrasonic trans-ducer(CMUT)bonded with a flexible printed circuit board(PCB)by flip chip technology.To develop a CMUT cylindrical array with high density and high consistency,the process flow of the CMUT curved array was designed,and the CMUT curved array was prepared.The center frequency of the prepared CMUT is 3 MHz.Then the CMUT array element was tested.The test results show that the capacitance mostly changes between 40 pF and 50 pF,and the transceiving performance of the CMUT array element is good.The prepared CMUT was bonded with the flexible PCB,the scribing was completed,then the grooves were filled with polydimethylsiloxane(PDMS),finally the metal upper electrode was sputtered after being stuck on the curved mold.Thus the CMUT curved array was prepared.The array can be bent in a specific direction,and the CMUT array elements of the curved array have good consistency.The further research will be to make the curved array transmit and receive in the way of row and column addressing and reduce the connection number of the array element electrodes.

关 键 词：微电子机械系统(MEMS) 电容式微机械超声换能器(CMUT) 曲面阵列 倒装焊 柔性材料 

分 类 号：TN305[电子电信—物理电子学] TB552[理学—物理]