电子工程增材制造研究现状及进展  

Research status and progress of additive manufacturing in electronic engineering

作　　者：卓龙超 尹恩怀 ZHUO Longchao;YIN Enhuai(School of Materials Science and Engineering,Xi'an University of Technology,Xi'an 710048,China;Xi'an Research Institute of Navigation Technology,China Electronics Technology Group Corporation,Xi'an 710068,China)

机构地区：[1]西安理工大学材料科学与工程学院,陕西西安710048 [2]中国电子科技集团公司第二十研究所,陕西西安710068

出　　处：《电子元件与材料》2023年第3期253-265,共13页Electronic Components And Materials

基　　金：国家自然科学基金(51604223);西安市科技计划先进制造业技术攻关项目(21XJZZ0048);陕西省重点研发计划(2023-YBGY-467)。

摘　　要：随着5G技术、可穿戴电子、物联网、智慧城市、工业网络化等的高速发展,智能化、轻薄化、小型化、高频、高精密度的电子产品市场需求越来越大。长期以来,传统电子制造行业普遍存在工序繁琐、交付周期长、供应链弹性低、污染严重等问题,且随着集成电路频率的增加,传统金丝/带键合技术在连接时产生诸多电性能弊端。随着工业4.0的兴起和增材制造产业的迅速发展,符合低碳经济发展战略的电子工程增材制造因诸多优势受到学术界与工业界高度关注,促使相关产业链发展方兴未艾。从电子工程增材制造领域的产生背景及意义、打印技术、打印材料和最新典型应用四个方面对电子工程增材制造的研究现状及进展进行了综述,并对其未来发展面临的若干挑战作出了展望。With the rapid development of 5G technology,wearable electronics,the Internet of Things,smart cities and industrial networking,the market demand for intelligent,thin,miniaturized,high-frequency and high-precision electronic products is growing.The traditional electronic manufacturing industry always faces the problems including cumbersome procedures,long lead time,low supply chain flexibility and serious pollution.Besides,with the increase in the frequency of integrated circuits,traditional gold wire/ribbon bonding techniques generate various electricity drawbacks during the connection.With the rise of Industry 4.0 and the rapid development of additive manufacturing industry,additive manufacturing in electronic engineering fits the low-carbon economic development strategy and attracts great attention from both academia and industry with an ascendant industrial chain development.This review summarizes the research status and progress of additive manufacturing in electronic engineering from its background and significance,printing technology,printing materials and the latest typical applications with an outlook on future development challenges.

关 键 词：电子工程 增材制造 综述 气溶胶喷射 超精密沉积 激光直写 颗粒型墨水 

分 类 号：TN40[电子电信—微电子学与固体电子学]