无氰银镍合金电镀液配比及镀层性能研究  

Study on the ratio of electroplating solutionand properties of cyanide-free Ag-Ni alloy coating

作　　者：朱明航 郑传波[1] 安相琛 ZHU Minghang;ZHENG Chuanbo;AN Xiangchen(School of Materials Science and Engineering,Jiangsu University of Science and Technology,Zhenjiang 212100,China)

机构地区：[1]江苏科技大学材料科学与工程学院,镇江212100

出　　处：《江苏科技大学学报（自然科学版）》2023年第1期26-34,共9页Journal of Jiangsu University of Science and Technology:Natural Science Edition

摘　　要：采用脉冲电源制备银镍合金镀层,研究无氰碘化物镀液组成和镀层性能.利用霍尔槽,使用单因素实验和正交实验研究镀层组成及其浓度,利用扫描电镜,能谱分析,ASR面比电阻测试系统和电化学测试方法镀层的微观结构、元素分布、导电性和耐腐蚀性能.结果表明:当镍银离子比为10∶1且银离子为0.03 mol/L时,镀液沉积电流密度范围最大;辅助络合剂中,EDTA和亚氨基二乙酸作用并不明显,丁二酸和甘氨酸最能够有效提高电流效率、扩大电流密度范围;优化镀液后,在温度30℃,电流密度1 A/dm^(2)工艺下制得镀层沉积致密,结合力较好,镀层为银68.4%,镍31.57%的简单机械混合物,难以形成稳定化合物;通过面比电阻测试系统和电化学工作站研究发现镀层导电性和耐腐性极好.Ag-Ni alloy coatings were prepared by a pulse power supply.The composition and properties of cyanide-free iodide plating solution were studied.The composition and concentration of the coating were studied by Hall cell,single factor experiments and orthogonal experiments.The microstructure,elemental distribution,electrical conductivity and corrosion resistance of the coating were studied by scanning electron microscopy,energy spectrum analysis,ASR surface specific resistance test system and electrochemical test method.The results showed that when the Ni/Ag ion ratio was 10∶1 and the Ag ion was 0.03 mol/L,the range of deposition current density was the largest.Among the auxiliary complexing agents,EDTA and iminodiacetic acid had no obvious effect,but anediacid and glycine were the most effective in improving the current efficiency and expanding the range of current density.After optimizing the bath,the coating was prepared at the temperature of 30℃and current density of 1 A/dm^(2).The coating was a simple mechanical mixture of 68.4%silver and 31.57%nickel,and it was difficult to form a stable compound.The electroconductivity and corrosion resistance of the coating were found to be excellent by the surface specific resistance test system and electrochemical workstation.

关 键 词：汇流环 银镍合金 无氰电镀 辅助络合剂 

分 类 号：TQ153.2[化学工程—电化学工业]