混压多层印制板多芯片收发组件关键技术研究  

Study on Key Technologies for Multi-chip T/R Module Based on Hybrid-laminated Multilayer Printed Circuit Board

作　　者：张兆华[1] 王庆 王珂珂 王锋[1] ZHANG Zhaohua;WANG Qing;WANG Keke;WANG Feng(Nanjing Research Institute of Electronics Technology,Nanjing 210039,China)

机构地区：[1]南京电子技术研究所,江苏南京210039

出　　处：《电子机械工程》2023年第2期46-49,共4页Electro-Mechanical Engineering

摘　　要：作为有源相控阵天线阵面的核心部件,收发组件在整个有源天线阵面中的成本占比最高,因此如何降低收发组件的成本是设计天线阵面需要着重考虑的问题。与多芯片收发组件中常用的低温共烧陶瓷(Low Temperature Co-fired Ceramic,LTCC)多层基板相比,多层印制板在成本方面具有很大优势。文中利用混压多层印制板,结合铝合金封装壳体,研制了一款Ku波段四通道低成本收发组件。该收发组件在工作频带内可以实现6位移相和6位幅度衰减,其通道接收增益≥20 dB,通道发射功率≥10 W。文中针对混压多层印制板热膨胀系数高、布线密度低、金丝键合可靠性差等问题,优化了基板叠层方案,研究了高密度互联通孔制作、基板镀层高可靠键合、低成本气密封装等关键工艺技术,有效提升了产品的可靠性,可为低成本混压多层印制板在多芯片组件中的工程化应用提供参考。As the key components of active phased array,the cost of T/R modules is the highest in the whole antenna array.Therefore,how to reduce the cost of T/R modules is an important problem which should be considered at the design stage.Compared with low temperature co-fired ceramic multilayer substrate,which is commonly used for multichip T/R module,multilayer printed circuit board has a huge cost advantage.In this paper,a Ku-band low cost four-channel transceiver is developed by using a hybrid-laminated multilayer printed circuit board,combined with an aluminum alloy package housing.This transceiver can achieve 6-bit phase shift and 6-bit amplitude attenuation.Its receiving channel gain is greater than or equal to 20 dB and its output power of transmitting channel is greater than or equal to 10 W.For the problems of high thermal expansion coeffcient,low wiring density and poor wire bonding reliability,the substrate stacking scheme is optimized and the key process technologies such as high-density interconnection through hole fabrication,highly reliable bonding of surface plating and low cost hermetic packaging have been researched,which can effectively improve the reliability of the products.This research can provide a reference for the engineering application of low-cost hybrid-laminated multilayer printed circuit boards in multi-chip module packaging.

关 键 词：多层印制板 收发组件 低成本 有源相控阵 混压工艺 

分 类 号：TN82[电子电信—信息与通信工程]