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作 者:费少华[1] 丁会明 汪海晋 李江雄 FEI Shao-hua;DING Hui-ming;WANG Hai-jin;LI Jiang-xiong(Key Laboratory of Advanced Manufacturing Technology of Zhejiang Province,Zhejiang University,Hangzhou 310027,China)
机构地区:[1]浙江大学浙江省先进制造技术重点实验室,浙江杭州310027
出 处:《浙江大学学报(工学版)》2023年第4期657-665,692,共10页Journal of Zhejiang University:Engineering Science
基 金:国家自然科学基金资助项目(51975520)。
摘 要:为了减少传统Z-pin增强工艺对复合材料层合板造成的面内性能损伤,提出超声引导直径为0.11 mm的微细Z-pin自动植入工艺.根据超声引导微细Z-pin植入原理,设计开发自动植入系统.根据Z-pin植入力特性,综合夹心式压电换能器的设计理论,设计纵振型超声振子,利用有限元仿真软件对超声振子进行模态及谐波响应分析,实测超声振子阻抗与振幅特性,得到谐振频率为70.0624 kHz,振幅为2.578μm,与仿真结果一致.搭建超声引导植入系统,对微细Z-pin增强复合材料层合板进行面内拉伸、压缩性能及层间断裂韧性测试.结果表明,对于体积分数为0.2%、直径为0.11 mm的微细碳纤维Z-pin增强复合材料层合板,拉伸、压缩强度分别下降1.6%和3.4%,Ⅰ型层间断裂韧性可以提升14.4倍.An ultrasound-guided fine Z-pin(with a diameter of 0.11 mm)automatic insertion system was proposed to reduce the in-plane damage of traditional Z-pinned composite laminates.The automatic insertion system was designed and developed by the ultrasound-guided fine Z-pin insertion principle.A longitudinal ultrasonic vibrator was designed and analyzed according to the force characteristics of Z-pin insertion process and the design theory of sandwich piezoelectric transducer.The modal and harmonic response of the vibrator was analyzed by using finite element simulation.Impedance analysis and amplitude measurement of the ultrasonic vibrator was conducted.Results showed that the resonant frequency was 70.0624 kHz and the actual vibration amplitude was 2.578μm,which accorded with the simulation results.The ultrasound-guided insertion system was constructed.The in-plane tensile,compressive properties and interlaminar fracture toughness of the fine carbon Z-pinned composite laminates were tested.Results show that the in-plane strength reduction is only 1.6%in tension and 3.4%in compression respectively for unidirectional fiber/epoxy laminates reinforced by carbon Z-pins whose volume fraction is 0.2%and diameter is 0.11 mm.The Mode-I fracture toughness can be improved by 14.4 times.
关 键 词:微细Z-pin 复合材料层合板 超声振动 面内损伤 层间断裂韧性
分 类 号:TB332[一般工业技术—材料科学与工程] TB552[理学—物理]
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