生瓷片通孔金属化工艺研究  

Research on Hole Metallization Technical of Green Ceramic Chip

作　　者：闫文娥 YAN Wen'e(The 2^(nd)Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工业专用设备》2023年第2期44-48,共5页Equipment for Electronic Products Manufacturing

摘　　要：通过工艺实验与通孔金属化原理相结合得出影响通孔金属化质量的原因,指出了人工取放定位生瓷片是造成金属化质量的主要原因;通过改变生瓷片的取放定位方式才能更好地保证通孔金属化质量,介绍了一种通孔金属化的新机构,并对该机构进行了结构组成和原理分析;通过工艺实验表明,新的金属化机构能更好地解决通孔金属化质量问题。The reasons that affecting hole metallization quality are obtained by combination of hole metallization process experiment and its principle in this paper.It is pointed out that artificial positioning process is the main reason to determinate hole metallization quality.By changing positioning method could assure hole metallization quality well.The new structure of hole metallization is introduced,the structural composition and principle of new structure are analyzed.Furthermore,by process experiment,it is concluded that new structure of the hole metallization could solve the problem of hole metallization quality well.

关 键 词：通孔金属化 金属化质量 工艺实验 

分 类 号：TN405.96[电子电信—微电子学与固体电子学]