新型倒置盲孔互连电路技术  

Research on new inverted blind hole interconnect circuit technology

作　　者：何润宏 林旭荣 HE Runhong;LIN Xurong(China Circuit(Shantou)Co.,Ltd.,Shantou 515065,Guangdong,China)

机构地区：[1]汕头超声印制板公司,广东汕头515065

出　　处：《印制电路信息》2023年第3期52-55,共4页Printed Circuit Information

摘　　要：印制电路板的倒置盲孔是类似传统的激光盲孔,在实际电路互连应用中有着明显的特点和优势。采用倒置盲孔完成的电子电路产品,在其外层可呈现一个完全平坦无凹陷的焊接面,不需要增加电镀填孔及任何特殊磨平处理工艺。倒置盲孔结构设计不但降低制程中电镀工艺的加工成本,减少面铜厚度,同时还避免传统电路板外层盲孔感光阻焊的孔内渗油、漏铜等各类品质问题发生,更有利于改善终端电子封装时出现的焊点空洞气泡焊接不良等问题。This paper focuses on the research of an inverted laser interconnection blind hole technology in electronic circuit products.The inverted blind hole in the circuit board is similar to the traditional laser blind hole,but has obvious characteristics and advantages in the actual circuit interconnection application.The electronic circuit products completed with inverted blind holes will present a completely flat and non-concave welding surface on its outer layer,without the need to add electroplating hole filling and any special polishing process.The inverted blind hole structure design not only reduces the processing cost of the electroplating process in the manufacturing process,but also reduces the thickness of the surface copper.At the same time,it also avoids various quality problems such as oil leakage and copper leakage in the hole of the blind hole photosensitive resistance welding in the outer layer of the traditional circuit board;Moreover,it is more conducive to improve the problems such as solder joint hole,bubble and poor soldering during terminal electronic packaging.

关 键 词：倒置盲孔 高密度互连板 盲孔凹陷 电镀填孔 

分 类 号：TN41[电子电信—微电子学与固体电子学]