铜线SSB互联技术的难点及工艺控制  

Difficulties and Process Control of Copper Wire SSB Interconnection Technology

作　　者：周金成 潘霞 李习周 ZHOU Jincheng;PAN Xia;LI Xizhou(Tianshui 749 Electronics Co.,Ltd.,Tianshui 741000,China)

机构地区：[1]天水七四九电子有限公司,甘肃天水741000

出　　处：《电子与封装》2023年第4期1-5,共5页Electronics & Packaging

摘　　要：分析了引线框架封装中铜丝键合的SSB (Stand-off Stitch Bond)互联的各种技术难点,并研究和验证了解决方案。从芯片、制具、材料、工艺等方面,分析了芯片的表面质量、键合夹具、键合劈刀等对铜丝SSB工艺的关键影响。研究了不同保护气体下的无空气球(FAB)尺寸的稳定性和不同保护装置中FAB形状的稳定性,以及防止铜丝SSB键合焊盘损伤和控制“铝挤出”的技术。确定了SSB工艺控制的要点及改善方法,并通过试验证实了所述措施与方法的有效性。Various technical difficulties of stand-off stitch bond(SSB)interconnection for copper wire bonded in lead frame packages are analyzed,and the solutions are studied and verified.The key effects of chip surface quality,bonding fixture and bonding cleaver on the SSB process of copper wire are analyzed from the aspects of chip,manufacturing tool,material and process.The stability of the free air ball(FAB)size under different protective gases and the stability of the FAB shape in different protective devices are investigated,as well as the techniques for preventing damage to the bonding pads of copper wire SSB and controlling“Al splash”.The main points and improvement methods of the SSB process control are determined,and the effectiveness of the measures and methods is verified through tests.

关 键 词：铜丝SSB键合 无空气球 氧化 焊盘损伤 铝挤出 

分 类 号：TN305.94[电子电信—物理电子学]