基于热测试芯片的2.5D封装热阻测试技术研究  

Research on Thermal Resistance Testing Technology of 2.5D Package Based on Thermal Test Chip

作　　者：吕晓瑞 刘建松 黄颖卓 林鹏荣 LYU Xiaorui;LIU Jiansong;HUANG Yingzhuo;LIN Pengrong(Beijing Institute of Microelectronics Technology,Beijing 100076,China)

机构地区：[1]北京微电子技术研究所,北京100076

出　　处：《电子与封装》2023年第4期6-11,共6页Electronics & Packaging

摘　　要：2.5D多芯片高密度封装中,多热源复杂热流边界、相邻热源热耦合增强,高精准的热阻测试与仿真模拟验证是封装热设计的关键。设计开发了基于百微米级发热模拟单元的热测试验证芯片(TTC),并基于多热点功率驱动电路系统和多通道高速采集温度标测系统,实现了2.5D多芯片实际热生成的等效模拟与芯片温度的多点原位监测。通过将实际热测试结构函数导入热仿真软件,实现了仿真模型参数的拟合校准,采用热阻矩阵法表征多芯片封装热耦合叠加效应,实现了多热源封装热阻等效表征。结果表明,多芯片封装自热阻和耦合热阻均随着芯片功率密度的增加而提高,芯片的热点分布对封装热阻值的影响更为显著,因此模拟实际芯片发热状态、建立等效热仿真模型是实现高精准封装热仿真和散热结构设计的关键。In 2.5D multi-chip high-density packaging,the complex heat flow boundaries of multiple heat sources and the thermal coupling of adjacent heat sources are enhanced,the high precision thermal resistance test and simulation verification are key to the thermal design of the package.A thermal test verification chip(TTC)based on 100-micron heat simulation units is designed and developed.Based on a multi-spot power driven circuit system and a multi-channel high-speed acquisition temperature mapping system,the equivalent simulation of the actual thermal generation of the 2.5D multi-chip package and the multi-point in situ monitoring of the chip temperature are realized.The actual thermal test structure function is imported into thermal simulation software to achieve the parameter fitting and calibration of simulation model.The thermal coupling superposition effect of multi-chip package is characterized by thermal resistance matrix method,and the equivalent thermal resistance of multi-heat source package is achieved.The results show that the self-thermal resistance and coupling thermal resistance of multi-chip package increase with the increase of chip power density,and the influence of hot spot distribution on the package thermal resistance is more significant.Therefore,simulating the heat state of the actual chip and establishing the equivalent thermal simulation model are key to achieve high precision package thermal simulation and heat dissipation structure design.

关 键 词：2.5D封装 多热源 多芯片封装热阻 结构函数 热阻矩阵 

分 类 号：TN305.94[电子电信—物理电子学]