国内印制电路板产品失效现状与改进  

Failure status of domestic PCB products and suggestions for improvement

作　　者：何骁[1] 周波 沈江华 贺光辉[1] HE Xiao;ZHOU Bo;SHEN Jianghua;HE Guanghui(The Fifth Research Institute of MIIT,P.R.China,Guangzhou 510610,Guangdong,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370

出　　处：《印制电路信息》2023年第4期55-60,共6页Printed Circuit Information

摘　　要：对本实验室2019—2022年承接的国内印制电路板(PCB)制造商及相关用户委托的失效案例开展统计,发现PCB自身质量异常已成为引起印制电路板组装(PCBA)失效的最主要问题。进一步对PCB总体失效模式与失效原因分布、不同排名PCB企业失效案例数量分布、军用PCB失效模式分布及民用PCB失效模式分布等进行分析,发现导通失效、可焊性不良、分层爆板和绝缘失效是PCB行业最为常见的4大失效模式。生产制程缺陷是造成PCB失效的最主要原因(69%);内资排前100名企业失效案例数量合计占比为48%,失效模式分布与整个PCB行业一致;军用PCB与民用PCB失效模式分布存在差异,军用PCB和民用PCB第一大失效模式分别为导通失效(49%)和可焊性不良(25%)。最后结合行业的失效问题现状,提出了改进建议。A statistical on the failure cases sent to the laboratory(CEPREI)from 2019 to 2022 by domestic PCB suppliers and users has been conducted in this paper,it is shown that the printed circuit board(PCB)quality problem is the leading factor to cause printed circuit board assembly(PCBA)failures.Further investigations have been carried out on overall PCB failure mode and failure cause distributions,distribution of failure case amount in PCB suppliers with different rankings and failure mode distribution in PCB for military or civil use,it is found that:conduction failure,poor weldability,delamination or blistering and insulation failure are the top four failure modes,the manufacturing process defect is the primary reason causing PCB failure with a ratio as high as 69%;the failure mode distribution of the top 100 domestic PCB suppliers is the same as the whole PCB industry,and the failure case ratio contributed by these suppliers is 48%;the failure mode distribution of PCB for military use is differernt from that for civil use,the first failure mode for military use is conduction failure with a ratio of 49%,while it is poor weldability for civil use with a ratio of 25%.Improvement suggestions are also provided based on the failure situation of domestic PCB industry.

关 键 词：印制电路板 印制电路板组装 失效现状 

分 类 号：TN41[电子电信—微电子学与固体电子学]