耐高温微系统气密封装技术及高温可靠性研究  

High-temperature microsystem packaging technology and high-temperature reliability

作　　者：刘佳欣 彭洋 胡剑雄 徐建 陈明祥[1] Jiaxin LIU;Yang PENG;Jianxiong HU;Jian XU;Mingxiang CHEN(School of Mechanical Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China;School of Aerospace Engineering,Huazhong University of Science and Technology,Wuhan 430074,China;School of Electrical and Electronic Engineering,Wuhan Polytechnic University,Wuhan 430023,China)

机构地区：[1]华中科技大学机械科学与工程学院,武汉430074 [2]华中科技大学航空航天学院,武汉430074 [3]武汉轻工大学电气与电子工程学院,武汉430023

出　　处：《中国科学：信息科学》2023年第4期803-814,共12页Scientia Sinica(Informationis)

基　　金：湖北省重点研发计划(批准号:2020BAB068,2021BAA071)资助项目。

摘　　要：针对武器装备、航空航天等领域高温封装需求,提出一种耐高温微系统气密封装技术.选用氮化铝直接电镀陶瓷基板(direct plated ceramic substrate, DPC)作为封装散热基板,可伐(Kovar)合金作为封装盖板,金锡合金(Au80Sn20)作为焊接材料实现气密封装,并通过有限元模拟优化了最小焊接应力下的焊环厚度.根据设计方案制备了集成热敏电阻和微型加速度计的微系统器件.测试结果表明,微系统封装样品焊接质量良好,界面无孔隙和裂纹.将封装后的微系统在200℃下老化1000 h,测试其老化前后的气密性和芯片电性能.结果表明,老化后微系统仍具有较高气密性,封装漏率达到10-9Pa·m3/s量级,热敏电阻及微型加速度计电信号正常.实验证明该耐高温微系统气密封装技术可满足高温应用可靠性需求,有望应用于航空航天及军工领域.To meet the requirements of high-temperature microsystem packaging in weapons,aerospace,and other fields,a high-temperature-resistant microsystem hermetic packaging technology is proposed.A direct plated ceramic substrate(DPC)made of aluminum nitride was used as the heat dissipation substrate,Kovar alloy was used as the cover plate,and Au80Sn20 was used as the welding material to achieve hermetic packaging.The thickness of the Au-Sn ring under minimum welding stress was optimized through finite element simulation.According to the design scheme,a microsystem integrating a thermistor and microaccelerometer is constructed.No pores and cracks could be observed in the cross sections of the microsystem packaging sample,indicating excellent welding quality.The packaged microsystem was aged for 1000 h at 200◦C,and the air leakage rate and chip electrical performance of the microsystem were measured before and after aging.The results showed that the microsystem remained air-tight even after aging,and the air leakage rate reached 10−9 Pam3/s.In addition,the electrical signals of the thermistor and microaccelerometer were normal.These experimental results demonstrate that the high-temperature microsystem hermetic packaging technology meets the reliability requirements of hightemperature applications and could be applied in aerospace and military fields.

关 键 词：高温封装 微系统 气密封装 直接电镀陶瓷基板(DPC) 金锡焊片 可靠性 

分 类 号：TJ05[兵器科学与技术—兵器发射理论与技术] V261[航空宇航科学与技术—航空宇航制造工程] TN05[电子电信—物理电子学]