印制电路组件清洁可靠性评估方法研究  

Study on Cleanliness Reliability Evaluation of PCBA

作　　者：楼倩[1] 郑焕军[1] LOU Qian;ZHENG Huanjun(CEPREI-EAST,Suzhou 215129,China)

机构地区：[1]工业和信息化部电子第五研究所华东分所,江苏苏州215129

出　　处：《电子产品可靠性与环境试验》2023年第2期76-80,共5页Electronic Product Reliability and Environmental Testing

摘　　要：采用IPC-B-52标准测试板设计方案,观察印制电路组件(PCBA)装配过程不同工艺环节在潮热环境中表面绝缘电阻的变化,通过数值量化不同工艺残留物对组件清洁可靠性的影响,筛选出匹配生产需求的材料及工艺兼容性。从清洁度的角度,对PCBA的电子装配过程进行了可靠性评估,可以帮助企业对制造工艺进行改进。The IPC-B-52 standard test vehicle is used to design the test scheme to observe the surface insulation resistance changes of PCBA in different processes of assembly in the hot and humid environment.The influence of different process residues on the cleanliness reliability of components is numerically quantified,and the materials and process compatibility matching the production requirements are selected.From the perspective of cleanliness,the reliability of PCBA electronic assembly process is evaluated,which can help the enterprise to improve the manufacturing process.

关 键 词：印制电路板组件 表面绝缘电阻 清洁可靠性 残留物测试 可靠性评估 

分 类 号：TN41[电子电信—微电子学与固体电子学]