有机硅凝胶及其在IGBT功率模块封装中的应用  

Silicone gel and its applications in IGBT power module package

作　　者：曾亮 何勇 刘亮 戴小平 张俊杰[3] ZENG Liang;HE Yong;LIU Liang;DAI Xiaoping;ZHANG Junjie(Coresing Semiconductor Technology Co.,Ltd.,Zhuzhou 412001,China;Hunan Power Semiconductor Manufacturing Innovation Center,Zhuzhou 412001,China;Guilin Electrical Equipment Scientific Research Institute Co.,Ltd.,Guilin 541004,China)

机构地区：[1]湖南国芯半导体科技有限公司,湖南株洲412001 [2]湖南省功率半导体创新中心,湖南株洲412001 [3]桂林电器科学研究院有限公司,广西桂林541004

出　　处：《绝缘材料》2023年第5期26-31,共6页Insulating Materials

基　　金：湖南省科技计划项目(2018XK2202)。

摘　　要：为了评估国产有机硅凝胶在绝缘栅双极晶体管(IGBT)功率模块封装中的应用情况,选取了3种国产有机硅凝胶进行综合性能对比,包括固化前外观、密度、黏度、混合比例和凝胶时间,固化后绝缘性能、渗油性、阻尼性、粘附性和200℃下耐高温性能等。分析了3种有机硅凝胶样品的差异,并利用其分别封装IGBT功率模块,对所封装的模块进行温度循环测试。结果表明:有机硅凝胶的起始黏度和混合比例对封装工艺和封装设备有影响,固化后锥入度、绝缘性能、渗油性、阻尼性、粘附性等性能对有机硅凝胶型号的选用有指导作用,耐高温性能和耐温度循环能力是评估样品能否用于IGBT功率模块封装重要的指标。In order to evaluate the application of silicone gels in the packaging of IGBT power modules,three domestic silicone gels were selected for comprehensive comparison,including the appearance,density,viscosity,mixing ratio,and gel time before curing and insulating properties,oil penetration,damping,adhesion force,and high temperature resistance at 200℃ after curing.The differences of the three silicone gels were analyzed,and IGBT power module was encapsulated with the three silicone gels,respectively,then the encapsulated modules were conducted the temperature cycle test.The results show that the initial viscosity and mixing ratio of silicone gels have an impact on the packaging process and equipment,and the penetration,insulating properties,oil penetration,damping,and adhesion after curing have a guiding role in the selection of silicone gel,but the high temperature resistance and temperature cycling resistance are the most important indicators to evaluate whether the sample can be applied to the packaging of IGBT power module.

关 键 词：有机硅凝胶 封装材料 功率模块 IGBT模块 

分 类 号：TM215[一般工业技术—材料科学与工程]