耐空间环境的航天器刚挠板设计与工艺验证  

Design and Process Validation for Space Environmental Rigid-Flexible Rrinted Board

作　　者：陈材 祁俊峰 杨猛[1] 张彬彬[1] CHEN Cai;QI Junfeng;YANG Meng;ZHANG Binbin(Beijing Spacecraft,China Academy of Space Technology,Beijing 100190,China)

机构地区：[1]中国空间技术研究院北京卫星制造厂有限公司,北京100190

出　　处：《电子工艺技术》2023年第3期9-12,共4页Electronics Process Technology

基　　金：装发预先研究项目(50923030901)。

摘　　要：结合航天应用需求,设计了一种聚酰亚胺基的刚挠板。对刚挠板的选材、接插方式进行了研究,连接部位采用接插件形式,可以提供较高的电气、机械连接可靠性。通过外形检查、金相剖切等手段,研究了焊接温度、返修次数对刚挠板装联质量的影响,3种焊接温度下均未对刚挠板造成损伤,在保证焊透率的前提下,焊接温度可以低至260℃,返修次数建议少于3次。按照航天电子产品质量标准要求,对焊接及返修工艺样品进行了模拟空间环境试验,抗挠曲性能达到5000次。Polyimide-based rigid-fl exible printed boards are designed for aerospace application demand.The materials selection and connection manners are considered.The connection part adopts the form of connector,which can provide high electrical and mechanical connection reliability.By means of appearance inspection and metallographic sectioning,the influences of soldering temperature and repair-time for the corresponding FPC quality are studied.The rigid-flexible printed boards are not damaged under the three soldering temperatures.On the premise of ensuring full-penetration,the soldering temperature can be as low as 260􀀀,and the repair times are recommended to be less than 3.According to the quality standard of aerospace electronic products,the soldering and repair process samples are tested in simulated space environment,and the defl ection resistance reached 5000 times.

关 键 词：刚挠板 焊接 返修 航天器 

分 类 号：TN605[电子电信—电路与系统]