LTCC基板内嵌金属柱多层微流道技术  

Technology of Multi-layer Micro-channel with Embedded Metal Microstructure in LTCC Substrate

作　　者：张遇好 袁海 王明琼 肖刚 郭竞飞 ZHANG Yuhao;YUAN Hai;WANG Mingqiong;XIAO Gang;GUO Jingfei(Xi’an Microelectronic Technology Institute,Xi’an 710000,China)

机构地区：[1]西安微电子技术研究所,西安710000

出　　处：《电子工艺技术》2023年第3期35-37,59,共4页Electronics Process Technology

摘　　要：针对混合模块功率集成密度增加带来的热管理效率提升困难问题,开展了LTCC基板内嵌金属柱多层微流道结构设计、工艺制造与散热性能研究。结果显示多层微流道内嵌金属柱能有效提升LTCC基板热管理效率,对于典型发热功率15 W的热源,微流道工作时热源温度由175℃以上降低到80℃以内,为提升高集成密度模块热管理效率提供新思路与方法。In order to solve the diffi cult problem of improving thermal management effi ciency caused by the increase of power integration density of hybrid modules,the structural design,process manufacturing and heat dissipation performance of multi-layer micro-channels with metal columns embedded in LTCC substrate are studied.The results show that the metal column embedded in multi-layer micro-channel can effectively improve the thermal management effi ciency of LTCC substrate.For a typical heat source with 15 W heating power,the temperature of heat source is reduced from more than 175℃to less than 80℃when the microchannel is working.It provide a new idea and methods for improving the thermal management effi ciency of high integrated density modules.

关 键 词：LTCC基板 内嵌金属柱 微流道 

分 类 号：TN605[电子电信—电路与系统]