集成电路ESD防护关键技术分析  

Analysis of Key Technologies for ESD Protection of Integrated Circuits

作　　者：晁瑞辰 Chao Ruichen(Zhejiang Institute of Tongji University,Jiaxing Zhejiang 314051)

机构地区：[1]同济大学浙江学院,浙江嘉兴314051

出　　处：《现代工业经济和信息化》2023年第4期248-250,共3页Modern Industrial Economy and Informationization

摘　　要：在电子科技飞速发展的今天,人们已经不止局限于电子产品新功能的开发,而更注重于产品的质量、安全性以及其外形。在芯片的生产过程中,其工艺不断进步、提高,然而这却同时带来一个弊端,即芯片对于ESD防护能力的下降,因此针对这一情况,对集成电路ESD防护技术的开展进一步研究。In the rapid development of electronic technology today,people have not only limited to the development of new functions of electronic products,but also pay more attention to the quality,safety and appearance of the products.In the process of chip production,the process is constantly progressing and improving,but this brings a disadvantage that the chip's ESD protection ability decreases,so in response to this situation,the technology of integrated circuit ESD protection should be further studied.

关 键 词：集成电路 ESD防护 分析 

分 类 号：TN405[电子电信—微电子学与固体电子学]