Chiplet基三维集成技术与集成微系统的新进展  

New Advances in Chiplet-Based 3D Integration Technology and Integrated Microsystems

作　　者：赵正平[1,2] Zhao Zhengping(China Electronics Technology Group Corporation,Beijing 100846,China;National Key Laboratory of Solid-State Microwave Devices and Circuits,Shijiazhuang 050051,China)

机构地区：[1]中国电子科技集团公司,北京100846 [2]固态微波器件与电路全国重点实验室,石家庄050051

出　　处：《微纳电子技术》2023年第4期477-495,共19页Micronanoelectronic Technology

摘　　要：集成电路在后摩尔时代的发展呈现出多模式创新的特点。综述了后摩尔时代中一大创新发展热点,即chiplet基3D集成技术与集成微系统的最新进展。综述并分析了当今chiplet基3D集成技术的关键技术的发展现状与趋势,包含3D集成技术、chiplet之间的宽带互连、布局布线与时钟同步、热管理、计算机辅助设计(CAD)等方面的创新。并展现了基于这些关键技术的突破,集成微系统的新进展,包含高性能计算多核处理器、神经网络计算处理器、神经网络加速器、射频微系统和光电微系统的创新。集成微系统已进入智能微系统新发展阶段。The development of integrated circuit in the post-Moore era presents the characteristics of multi-mode innovation.One of the major innovation development hotspots in the post-Moore era is reviewed,i.e.the recent progress of chiplet-based 3D integration technology and integrated microsystems.The current development status and trends of the key technologies of chiplet-based 3D integration technology are reviewed and analyzed,including the innovations in 3D integration technology,broadband interconnection between chiplets,layout and clock synchronization,thermal management,computer-aided design(CAD)and so on.Based on the breakthrough of these key technologies,the new progress of integrated microsystems is presented,including the innovations of high-performance computing multi-core processors,neural network computing processors,neural network accelerators,radio frequency microsystems and photoelectric microsystems.Integrated microsystems have entered the new development stage of intelligent microsystems.

关 键 词：chiplet 3D集成 集成微系统 宽带互连 时钟 热管理 计算机辅助设计(CAD) 

分 类 号：TN302[电子电信—物理电子学] TN305.96