微惯性开关制作过程中界面结合强度研究  

Study on interfacial bonding strength during fabrication of micro inertial switch

作　　者：杜立群[1,2] 孔德健 王帅[2] 蔡小可 郭柄江 DU Liqun;KONG Dejian;WANG Shuai;CAI Xiaoke;GUO Bingjiang(State Key Laboratory of High-performance Precision Manufacturing,Dalian University of Technology,Dalian 116024,China;Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116024,China)

机构地区：[1]大连理工大学高性能精密制造全国重点实验室,辽宁大连116024 [2]大连理工大学辽宁省微纳米系统重点实验室,辽宁大连116024

出　　处：《光学精密工程》2023年第10期1464-1474,共11页Optics and Precision Engineering

基　　金：国家重点研发计划资助项目(No.2022YFB4601602);国家自然科学基金资助项目(No.51975103)。

摘　　要：在利用微电铸工艺制作惯性开关的过程中,经常会出现由于界面结合强度低而引起的铸层翘起问题。微电铸层与基板的界面结合强度低会降低微开关的制作成品率、延长制作周期、增加制作成本。针对这一问题,本文从界面钝化膜的角度,采用了“电解活化去除钝化膜”和“引入Cu过渡层”的方法。为探究钝化膜对界面结合强度的影响,通过Materials Studio软件对不同钝化膜去除率模型的界面结合能进行仿真计算,计算结果表明钝化膜去除率越高越有利于界面结合强度的提高,在完全去除钝化膜后界面结合强度提高了197%;为探究过渡金属对界面结合强度的影响,分别以Cu,Cr,Ti作为过渡层,与不锈钢基板和镍铸层建立结合层体系,计算体系的结合能,计算结果表明Cu与基板、Cu与铸层的结合能最高,与未引入过渡金属相比,引入Cu后界面结合强度提高了81%。在仿真研究结果的基础上,开展了电解活化实验,通过电解活化法去除了基板表面的钝化膜,实验结果表明:电解活化区域铸层的界面结合强度明显高于未活化区域铸层的界面结合强度;同时开展了铜过渡层实验,对比了有无Cu过渡层的界面结合强度,实验结果表明:引入Cu后,铸层的界面结合强度明显提高。在上述仿真和实验结果的基础上,制作出尺寸为23 mm×20 mm、总高度为900μm的微惯性开关。During the fabrication of inertial switches via micro-electroforming,casting layer warping is frequently encountered owing to the low bonding strength at the interface.Such low bonding strength between the micro-electrocasting layer and substrate is expected to reduce the production yield and prolong the production cycle while increasing production costs.To address this problem,in this paper,methods that involve"removing a passivated film using electrolytic activation"and"introducing a Cu transition layer"are proposed from an interface passivated film perspective.To explore the impact of the passivation film on the interface binding strength,the interface binding energies of different passivation film removal models are simulated using the Materials Studio software.The calculation results reveal that the higher the passivation film removal rate,the better the interface binding strength.The interface binding strength increases by 197%after the passivation film is completely removed.To examine the influence of transition metals on the interface binding strength,Cu,Cr,and Ti are used as transition layers to establish a bonding layer system with a stainless-steel substrate and nickel cast layer,and the binding energy of the system is determined.The calculation results reveal that the binding energy between Cu and the substrate,as well as between Cu and the cast layer,is higher.The interfacial bonding strength increases by 81%with the introduction of Cu compared to that without the introduction of the transition metal.Based on the simulation results,electrolytic activation experiments are conducted to remove the passivated film from the substrate surface using electrolytic activation.The experimental results indicate that the interfacial bonding strength of the cast layer in the electrolytic activation zone is significantly higher than that in the non-activated zone.Simultaneously,a similar Cu transition layer experiment is conducted,and it demonstrates that the interface bonding strength of the cast layer is signific

关 键 词：微惯性开关 微电铸 界面结合强度 分子动力学 电解活化 

分 类 号：TG111.4[金属学及工艺—物理冶金] TP212[金属学及工艺—金属学]