星载微组装T/R组件的封装设计  

Packaging Design of Micro-assembly T/R Module of Space-borne Radar

作　　者：吕慎刚[1] 江守利[1] LYU Shengang;JIANG Shouli(Nanjing Research Institute of Electronics Technology,Nanjing 210039,China)

机构地区：[1]南京电子技术研究所,江苏南京210039

出　　处：《电子机械工程》2023年第3期44-48,共5页Electro-Mechanical Engineering

摘　　要：有源相控阵天线在星载雷达上的应用越来越广泛,而T/R组件是有源相控阵天线的核心部件,直接影响天线的性能。封装可以为微组装T/R组件内部电子元器件和电路提供一个良好的工作环境,面对星载雷达对微组装T/R组件的高功率、高集成、高可靠性等要求,封装设计技术已成为微组装T/R组件设计的关键技术之一。基于封装设计技术在星载微组装T/R组件上的应用需求,文中介绍了T/R组件的基本组成,就封装材料与电连接器选用、封装结构设计以及环境适应性设计等封装设计关键问题进行了分析,并探讨了星载微组装T/R组件封装的发展方向。最后以某星载大功率T/R组件的封装设计作为示例,介绍了这些关键技术在设计过程中的应用情况,为后续星载微组装T/R组件的封装设计提供了参考。The active phased array antenna is more and more widely used in the space-borne radar.As the core part of the active phased array antenna,the T/R module directly affects the performance of active phased array antenna.Packaging can provide a good work environment for electronic components and circuits of micro-assembly T/R module.For requirements of high power,high integration,high reliability and so on,packaging design technology has become one of the key technologies for designing micro-assembly T/R module.Based on the application requirements of packaging in micro-assembly T/R module of space-borne radar,the basic composition of a T/R module is introduced,the key technologies of packaging design such as selection of packaging material and electrical connector,packaging structural design and environmental adaptability design are analyzed and the development prospect of the micro-assembly T/R module packaging for space-borne radar is discussed in this paper.At last the packaging design of a micro-assembly T/R module with high power for space-borne radar is presented as an example.It provides a reference for the subsequent packaging design of micro-assembly T/R module of space-borne radar.

关 键 词：星载雷达 微组装T/R组件 封装设计 环境适应性 

分 类 号：TN82[电子电信—信息与通信工程]