铜电镀方式对镍钯金表面打线键合性能的影响  

Study on the effect of copper electroplating to the wire bonding on enepig

作　　者：张钰松 姚晓建 钮荣杰 黄达武 曾文亮 ZHANG Yusong;YAO Xiaojian;NIU Rongjie;HUANG Dawu;ZENG Wenliang(Guangzhou Meadville Electronics Co.,Ltd.,Guangzhou 510663,Guangdong,China)

机构地区：[1]广州美维电子有限公司,广东广州510663

出　　处：《印制电路信息》2023年第6期52-57,共6页Printed Circuit Information

摘　　要：铜电镀方式不同,基铜衍射峰强度、晶面取向也会存在差异。在化学镀镍钯金时,不同铜电镀方式会影响金镀层的性能,从而对印制电路板(PCB)键合性能产生影响。通过研究垂直连续电镀、水平直流电镀和水平脉冲电镀3种电镀方式,分析不同电镀方式的基铜衍射峰强度、晶面取向、金面粗糙度、表面能对键合性能的影响。结果表明:基铜采用垂直连续电镀,铜镀层朝(111)晶面择优取向;金面粗糙度Ra为0.227μm、Rz为2.046μm;表面自由能为42.864 mN/m;金线拉力测试达到9.17 g,优于水平直流电镀与水平脉冲电镀。Different copper plating methods,the copper diffraction peak strength,crystal plane orientation will also be different,and affects the performance of the gold plating in ENEPIG,thereby affecting the PCB bonding performance.In this paper,the effects of diffraction peak intensity,crystal plane orientation,gold surface roughness and surface energy on the bonding performance of PCB are analyzed by three electroplating methods:vertical continuous plating,horizontal direct plating and horizontal pulse plating.The results show that the copper is plated by vertical continuous plating,and the copper plating is preferentially oriented towards(111)crystalline plane,the gold surface roughness Ra is 0.227μm,Rz is 2.046μm,the surface energy reaches 42.864 mN/m,and the gold wire pull test reaches 9.17g,better than horizontal direct plating and horizontal pulse plating.

关 键 词：铜电镀方式 化学镀镍钯浸金 键合 

分 类 号：TN41[电子电信—微电子学与固体电子学]