高频高耐热覆铜板设计及性能研究  

Design and performance of high frequency and high heat resistant copper clad

作　　者：顾思帆 秦会斌[1] 周继军[1] GU Si-fan;QIN Hui-bin;ZHOU Ji-jun(Institute of New Electron Device&Application,Hangzhou Dianzi University,Hangzhou 310018,China)

机构地区：[1]杭州电子科技大学新型电子器件与应用研究所,浙江杭州310018

出　　处：《热固性树脂》2023年第1期39-43,49,共6页Thermosetting Resin

基　　金：安徽省重点研究与开发计划项目(202004g01020003)。

摘　　要：在双环戊二烯型环氧树脂(DCPD-EP)中,添加了不同质量分数的二胺型苯并恶嗪(MDA-BZ)与双环戊二烯苯酚型酚醛树脂(DCPD-PF)得到三元共混体系,通过红外光谱、示差扫描量热分析研究了它们对体系固化反应及耐热性能的影响。以此三元共混体系为基体制备了覆铜板,并对覆铜板的热性能、介电性能及剥离强度进行了测试。结果表明:当MDA-BZ和DCPD-PF的质量分数均为50%时,体系的综合性能最佳,此时热失重5%的温度可达381℃,10 GHz下覆铜板的介电常数为3.63,介电损耗为0.0077。增加DCPD-PF用量可以降低体系的固化温度,提高覆铜板的热稳定性以及剥离强度。The diamine benzoxazine(MDA-BZ)and dicyclopentadiene phenolic resin(DCPD-PF)with different mass fractions were added to the dicyclopentadiene epoxy resin(DCPD-EP)and the ternary blending system was obtained.And their effects on the curing reaction and heat resistance of the system were studied by infrared spectroscopy and differential scanning calorimetric analysis.The copper clad laminate(CCL)was prepared with this ternary blending system as the matrix,and the thermal properties,dielectric properties and peel strength of the CCL were tested.The results showed that when the mass fraction of MDA-BZ and DCPD-PF was 50%,respectively,the comprehensive performance of the system was the best,the temperature of 5%thermal weight loss could reach 381 C.The dielectric constant of the CCL at 10 GHz was 3.63,and the dielectric loss was 0.0077.With the increase of DCPD-PF amount,the curing temperature of the system could be reduced,and the thermal stability and peel strength of the CCL could be improved.

关 键 词：覆铜板 双环戊二烯型环氧树脂 二胺型苯并恶嗪 酚醛树脂 固化反应 热稳定性 介电性能 剥离强度 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业] TQ323.1