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作 者:陈强[1] 白书欣[1] 叶益聪[1] CHEN Qiang;BAI Shuxin;YE Yicong(Department of Materials Science and Engineering,College of Aerospace Science and Technology,National University of Defense Technology,Changsha 410073,China)
机构地区:[1]国防科技大学空天科学学院材料科学与工程系,长沙410073
出 处:《无机材料学报》2023年第6期634-646,共13页Journal of Inorganic Materials
摘 要:碳化硅陶瓷基复合材料以其高比强度、高比模量、高导热、良好的耐烧蚀性能、高温抗氧化性、抗热震性能等特性,广泛应用于航空航天、摩擦制动、核聚变等领域,成为先进的高温结构及功能材料。本文综述了高导热碳化硅陶瓷基复合材料制备及性能等方面的最新研究进展。引入高导热相,如金刚石粉、中间相沥青基碳纤维等用以增强热输运能力;优化热解炭炭与碳化硅基体界面用以降低界面热阻;热处理用以获得结晶度更高、导热性能更好的碳化硅基体;设计预制体结构用以建立连续导热通路等方法,提高碳化硅陶瓷基复合材料的热导率。此外,本文展望了高导热碳化硅陶瓷基复合材料后续研究方向,即综合考虑影响碳化硅陶瓷基复合材料性能要素,优化探索高效、低成本的制备工艺;深入分析高导热碳化硅陶瓷基复合材料导热机理,灵活运用复合材料结构与性能的构效关系,以期制备尺寸稳定、具有优异热物理性能的各向同性高导热碳化硅陶瓷基复合材料。Silicon carbide ceramic matrix composites have been widely used in aerospace,friction brake,fusion fields and so on,and become advanced high-temperature structural and functional composites,due to their high specific strength and specific modulus,excellent ablation and oxidation resistance,and high conductivity and good thermal shock resistance.This paper reviews the latest research progress in preparation and property of silicon carbide ceramics matrix composites(CMCs)with high thermal conductivity.Researchers have improved the thermal conductivity of silicon carbide CMCs,including by introducing highly thermal conductive phases for reinforcing heat transport,such as diamond powders,and mesophase pitch-based carbon fibers(MPCF),by optimizing the interface between pyrolytic carbon(PyC)and silicon carbide matrix for reducing interfacial thermal resistance,by heat-treating for obtaining silicon carbide matrix with higher crystallinity and better thermal conductivity,and by designing preform structure for establishing continuous thermal conduction path.Meanwhile,research interests on silicon carbide CMCs are to explore new preparation with high efficiency and low cost through optimising their influencing factors,and to obtain isotropic highly thermal conductivity with dimensional stability and physical properties through deep understanding their thermal conductive mechanism,and flexible method based on the structure-activity relationship.
分 类 号:TB332[一般工业技术—材料科学与工程]
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