密封连接器电镀过程仿真优化  

Simulation of Electroplating Process for Sealed Connectors

作　　者：付定国 孙伟 Fu Dingguo;Sun Wei(Guizhou Aerospace Electrical Appliances,Guiyang 550009,China)

机构地区：[1]贵州航天电器,贵州贵阳550009

出　　处：《广东化工》2023年第11期110-114,共5页Guangdong Chemical Industry

摘　　要：密封连接器密封连接器在电镀时采用挂镀的方式,由于受主盐浓度、导电盐、电流密度分布等影响,在挂具不同位置的零件,其镀层厚度一致性比较差,不仅导致镀金成本显著增加,同时在低电流密度区出现漏镀情况,影响了密封连接器产品的外观、耐蚀性能等。本文主要从密封连接器电镀所使用的挂具和镀槽中的阳极排布出发,运用有限元多物理场仿真,对密封连接器在电镀过程中的电力线分布和镀层厚度进行仿真计算,对挂具和阳极板进行优化,提高密封连接器镀层的均镀能力,并通过实物加工验证仿真结果的有效性,从而实现密封连接器的产品性能提升和镀金成本降低。The sintered components of the sealing connector are plated by hanging method.Due to the influence of the concentration of the main salt,the conductive salt and the distribution of the current density,the components in different positions of the hanging device,the poor consistency of coating thickness not only increases the cost of gold plating,but also causes leakage in the low current density area,which affects the appearance and corrosion resistance of the sealing connector.In this paper,the finite element multi-physical field simulation is used to simulate the plating process of the sealing connector,the power line distribution and coating thickness of the sealing connector in the electroplating process were simulated,and the hanging fixture and anode plate were optimized to improve the coating uniformity of the sintered components,the validity of the simulation results is verified by physical processing,so that the product performance of the seal connector is improved and the cost of gold plating is reduced.

关 键 词：密封连接器 均镀能力 多物理场 电导率 电流密度 

分 类 号：TQ[化学工程]