低温固化导电银浆体系研究进展  

Research progress on low-temperature curing conductive silver paste system

作　　者：苗祥森 孙莹[1] 张雪勤[1] Miao Xiangsen;Sun Ying;Zhang Xueqin(School of Chemistry and Chemical Engineering,Southeast University,Nanjing 211189,Jiangsu,China)

机构地区：[1]东南大学化学化工学院,江苏南京211189

出　　处：《中国胶粘剂》2023年第5期63-68,共6页China Adhesives

基　　金：江苏省重点研发计划项目(BE2022025-2)。

摘　　要：低温固化导电银浆作为制备电子元器件的关键功能材料,能够在固化后拥有优异的电导率、硬度、附着力及耐弯折性等性能,已被广泛应用于电子信息工业领域。本文综述了低温固化导电银浆体系中不同形貌粒径银粉的复配、有机树脂的性质、溶剂和常见助剂对其性能的影响,并列举了该体系在导电胶领域的一些应用。展望了未来电子信息行业对低温固化导电银浆更高的应用要求。Low-temperature curing conductive silver paste,as key functional material for the preparation of electronic components,has excellent properties such as electrical conductivity,hardness,adhesion and bending resistance after curing,and has been widely used in the field of electronic information industry.In this paper,the compounding of silver powder with different morphologies and sizes in low-temperature curing conductive silver paste system,the properties of organic resin,solvent and common additive on its properties were reviewed,some application of this system in the field of conductive adhesive was listed.The higher application requirements of lowtemperature curing silver paste in future electronic information industry were prospected.

关 键 词：银粉复配 纳米银粉 有机树脂 导电银浆 导电胶 

分 类 号：TQ430.4[化学工程]