SiC/SiC复合材料切割方法对比研究  

Comparative Study on Cutting Methods of SiC/SiC Composites

作　　者：焦健 杨金华 侯金涛 刘虎 艾莹珺 周怡然 JIAO Jian;YANG Jinhua;HOU Jintao;LIU Hu;AI Yingjun;ZHOU Yiran(Key Laboratory of Advanced Composites,AECC Beijing Institute of Aeronautical Materials,Beijing 100095,China;Aerospace materials testing and Research Center,AECC Beijing Institute of Aeronautical Materials,Beijing 100095,China)

机构地区：[1]中国航发北京航空材料研究院,先进复合材料科技重点实验室,北京100095 [2]中国航发北京航空材料研究院,航空材料检测研究中心,北京100095

出　　处：《中国陶瓷》2023年第6期57-67,共11页China Ceramics

摘　　要：分别采用纳秒激光、毫秒激光、磨料水射流、线切割及金刚石线锯等方法对熔融渗硅工艺制备的SiC/SiC复合材料进行切割,比较了不同方法的切割效率、表面粗糙度、加工锥度及切割面的形貌特征。研究结果表明,毫秒激光加工效率最高,可达121.2 mm/min;纳秒激光切割时激光入口处与出口处存在明显不同的形貌;磨料水射流加工切割锥角最大,为10.6°;线切割表面存在12μm左右的热影响区;金刚石线锯切割的表面粗糙度最小,Ra为0.32μm。In this paper,the SiC/SiC composites prepared by melt infiltration process were cut by nanosecond laser,millisecond laser,abrasive water jet,Wire cut electrical discharge machining(WEDM)and diamond wire saw respectively.The cutting efficiency,surface roughness,machining taper and shape characteristics of cutting surface of different methods were compared.The results show that the millisecond laser processing efficiency is the highest,up to 121.2 mm/min.There are obviously different morphologies at the entrance and exit of nanosecond laser cutting.The cutting cone angle of abrasive water jet machining is 10.6°.There is a heat affected zone of about 12μm on the WEDM surface.The surface roughness cut by diamond wire saw is the smallest,and the Ra is 0.32μm.

关 键 词：SIC/SIC复合材料 激光加工 磨料水射流 线切割 金刚石线锯 

分 类 号：TQ174.13[化学工程—陶瓷工业]