一种提升PCB载流能力的设计方法  

Design Scheme to Improve PCB Current Carrying Capacity

作　　者：付可心 曾敏华 

机构地区：[1]研祥智能科技股份有限公司研发中心,广东深圳518107 [2]国家特种计算机工程技术研究中心,广东深圳518107

出　　处：《工业控制计算机》2023年第6期136-137,共2页Industrial Control Computer

摘　　要：随着电子信息行业的不断发展,电子设备功能日渐多元,设备功率越来越高,设备电流也越来越大。此类设备的电路板设计要求具有较大的载流能力,基于此类需求,提出了一种通过优化PCB中铜箔路径来提升PCB载流能力的设计。With the development of the electronic information industry,the functions of electronic equipment are becoming more and more diversified,the power of equipment is getting higher and higher,and the equipment current is getting larger and larger.The circuit board design of this kind of equipment requires a large load capacity.Based on such requirements,this paper proposes a design to improve PCB current carrying capacity by optimizing the copper foil path in PCB.

关 键 词：PCB 载流 铜箔 过孔 

分 类 号：TN41[电子电信—微电子学与固体电子学]