超大规模CCGA器件多类型焊柱板级组装工艺研究  

Research on Board-level Assembly for Ultra large-Scale CCGA Devices of Different Kinds of Solder Columns

作　　者：袁渊 张志模 梁佩 朱家昌 YUAN Yuan;ZHANG Zhi-mo;LIANG Pei;ZHU Jia-chang(The 58th Institute of China Electronics Technology Group Corporation;Wuxi Zhongwei High-tech Electronics Co.,Ltd.)

机构地区：[1]中国电子科技集团公司第五十八研究所 [2]中微高科电子有限公司

出　　处：《中国集成电路》2023年第6期75-80,共6页China lntegrated Circuit

摘　　要：基于电子元器件表面贴装工艺,研究了超大规模CCGA2577器件使用三种不同类型焊柱进行板级组装工艺试验,对PCB焊盘锡膏涂覆、回流焊接以及回流后的焊接效果表征等关键工艺步骤进行了研究和评估。工艺试验结果表明:SMT工艺能力可以较好地覆盖2500Pin级CCGA器件板级组装。对照使用传统Sn10Pb90焊柱、铜绕带螺旋型增强焊柱、微簧焊柱等不同材质和种类的焊柱进行板级组装,均能取得良好的组装效果。可靠性测试结果表明:使用铜绕带螺旋焊柱的CCGA2577器件的温循寿命可达1000次以上,且经过随机振动后电通断测试正常。Based on the surface mounting technology of electronic components,board-level assembly process for ultra large scale CCGA devices was studied in this paper.The main process steps,such as solder paste coating on PCB pad,reflow process and characterization of soldering quality are discussed together.The results show that the existing SMT ability can cover the 2500 Pin CCGA assembly.Board level assembly by using different kinds of solder columns,such as plain Sn10Pb90 solder columns,copper tripe-wound solder columns and micro-coil spring solder columns were tested,all of them can get high assembly quality.Reliability test result shows that thermal cycle life for a CCGA device using copper stripe-wound solder columns can reach 1000 times or more,and the open short test was normal after random vibration.

关 键 词：陶瓷栅格阵列 板级组装 表面贴装工艺 可靠性 

分 类 号：TG44[金属学及工艺—焊接] TN05[电子电信—物理电子学]