一种解决LTCC基板焊接裂纹方法的研究  

Research on a Method for Solving Welding Cracks in LTCC Substrates

作　　者：张艳辉 于卫龙 马其琪 贾少雄 ZHANG Yanhui;YU Weilong;MA Qiqi;JIA Shaoxiong(The Second Research Institute of China Electronics Technology Corporation,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《科技创新与生产力》2023年第5期114-116,120,共4页Sci-tech Innovation and Productivity

摘　　要：本文从原材料、生产工艺、焊接工艺3个方面,对LTCC基板在组装回流焊过程中QFN器件管脚产生裂纹的原因进行分析。结果表明,在管脚焊盘下设置通孔,能有效降低LTCC基板热应力,解决LTCC基板焊接裂纹问题,保证产品可靠性。From 3 aspects of raw materials,production process and welding process,this paper analyzes the causes of cracks on QFN device pins during LTCC substrate reflow soldering assembly.The results show that setting through-holes under the pin pads can effectively reduce the thermal stress of LTCC substrate,solve the problem of welding cracks in LTCC substrate,and ensure product reliability.

关 键 词：LTCC基板 LTCC基板焊接裂纹 QFN器件管脚 管脚焊盘裂纹通孔 

分 类 号：TN405[电子电信—微电子学与固体电子学]