基于数字化设计仿真的射频干扰抵消SiP设计  

Design of RF interference cancellation SiP based on digital design and simulation

作　　者：徐晓瑶[1] 黄晓国[1] 张琦[1] 姜建军[1] XU Xiaoyao;HUANG Xiaoguo;ZHANG Qi;JIANG Jianjun(No.36 Institute of China Electronic Technology Group Corporation,Jiaxing 314033,China)

机构地区：[1]中国电子科技集团公司第三十六研究所,浙江嘉兴314033

出　　处：《现代电子技术》2023年第14期141-146,共6页Modern Electronics Technique

摘　　要：随着无线电子系统朝着阵列化、微系统化、高频化等方向发展,系统调试难、失效、故障难以排除等问题逐渐凸显,基于“经验设计+后续调试”的传统设计方法已难以满足实际需求。基于机、电、热、磁等多学科数字化协同设计仿真能够对各设计阶段进行指导与验证,在提高设计效率的同时保证产品的性能指标,是微系统的主流设计方法。基于此,文中以射频干扰抵消SiP为例,详细介绍电、磁、热协同设计仿真的整个设计流程。实验表明,所提设计达到了预期目标,可为从事硬件电路设计者提供指导与参考。With the development of wireless electronic systems towards array,microsystemization,high-frequency,and other directions,problems such as difficulty in system debugging,failure,and difficulty in troubleshooting have gradually become prominent.The traditional design method based on"experiential design+subsequent debugging"is no longer able to meet practical needs.Based on multidisciplinary digital collaborative design simulation of mechanical,electrical,thermal,magnetic,and other disciplines,various design stages can be guided and verified,and the design efficiency can be improved while ensuring product performance indicators,which is the mainstream design method for microsystems.On this basis,taking the RF interfere cancellation SiP(system in package)as an example,the whole design process of electrical,thermal,magneticcooperative design simulation is introduced in detail.The experimental results show that the proposed design reach the expected goal,which can provide guidance and reference for the designer of hardware circuit.

关 键 词：射频干扰抵消 系统级封装 Ballmap预布局 数字化协同设计 信号完整性 电源完整性 热仿真 

分 类 号：TN921-34[电子电信—通信与信息系统]