DARPA电子复兴计划中的射频三维异构集成技术  

RF 3D Heterogeneous Integration Technologies in DARPA ERI

作　　者：曾策[1] 高能武[1] ZENG Ce;GAO Neng-wu(The 29th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《中国电子科学研究院学报》2023年第4期378-385,共8页Journal of China Academy of Electronics and Information Technology

摘　　要：三维异构集成(3D Heterogeneous Integration,3DHI)是美国国防高级研究计划局(DARPA)电子复兴计划(ERI)中持续聚焦发展的重点领域之一。分析ERI项目中有关射频三维异构集成技术的研究进展,剖析典型射频微系统创新应用案例,解析新技术应用转化动态及技术路线图。面向军事电子装备对射频系统微型化、多功能、可重构、高性能需求的挑战,梳理ERI 2.0在三维异构集成研究领域的进一步发展思路及新项目布局,提出ERI对射频微系统集成技术发展的借鉴与启示意义。3D Heterogeneous Integration(3DHI) is one of the priority technology areas of the Electronic Renaissance Initiative(ERI) of the U.S.Defense Advanced Research Projects Agency(DARPA).Analysis of the technical progresses within ERI programs related to RF 3D Heterogeneous Integration,profiling of typical innovative RF microsystem application cases,and insight into state-of-the-art technology leveraging trends and the roadmap.To meet the challenges of miniaturization,multi-function,reconfigurability,and high performance of RF systems for military electronic equipment,the further development concepts and new programs of ERI 2.0 in the field of 3D heterogeneous integration are described,and the implications of the ERI for the development of RF microsystem integration technologies are proposed.

关 键 词：电子复兴计划 三维异构集成 射频微系统 化合物半导体 芯粒 

分 类 号：TN405[电子电信—微电子学与固体电子学]