图形电镀前处理与图电匹配性研究  

Study on the matching of pretreatment of pattern electroplating with pattern plating

作　　者：高群锋 GAO Qunfeng(Shanghai Meiwei Electronics Co.,Ltd.,Shanghai 201613,China)

机构地区：[1]上海美维电子有限公司,上海201613

出　　处：《印制电路信息》2023年第7期25-29,共5页Printed Circuit Information

摘　　要：印制电路板(PCB)布线密度不断增加,给线路制作带来较大的难度。在保证精细线路制作品质的前提下,研究低微蚀量对铜面粗糙度和图形制作的影响越来越重要。通过对不同药水的铜面粗糙度效果和扫描电子显微镜(SEM)状况的研究结果,选择适合低微蚀量制作的前处理药水。在保证粗糙度R_(a)>0.2μm的前提下,通过控制低微蚀量和酸洗缸铜离子浓度,解决了碱性蚀刻流程图形渗锡的问题,找到了低微蚀量超粗化前处理和图形电镀制作的匹配方法。With the wiring density of PCB increasing,greater challenges are brought about to circuit production.In order to reduce the pre-processing etching of copper thickness,on the premise of ensuring the quality of fine circuit fabrication,it is more and more important to study the effect of low micro-etching amount on copper surface roughness and pattern forming.Based on the results of the study on the copper surface roughness and scanning electron microscope(SEM)morphology of different potions,the pretreatment potions suitable for the production of low micro-etching amount are selected.The tin penetration problem during the alkaline etching process of pattern is solved by low micro-etching control R_(a)>0.2μm and copper ion concentration control in pickling tank under the premise of ensuring the roughness.The matching between low micro-etching and ultra-coarsening pretreatment and pattern electroplating production is found.

关 键 词：印制电路板(PCB) 微蚀 酸洗 图形电镀 渗锡 

分 类 号：TN41[电子电信—微电子学与固体电子学]