改善高密度互连板镀铜填孔漏填的研究  

Improvement of missing filling in copper plating holes on HDI PCB

作　　者：杨云 吴都 曹大福 YANG Yun;WU Du;CAO Dafu(Sheng Yi Electronics Co.,Ltd.,Dongguan 523127,Guangdong,China)

机构地区：[1]生益电子股份有限公司,广东东莞523127

出　　处：《印制电路信息》2023年第7期30-35,共6页Printed Circuit Information

摘　　要：阐述高密度互连(HDI)板盲孔镀铜填孔过程中常见的漏填、凹陷和空洞3种缺陷,主要对漏填类型进行失效原因分析,其失效形态有盲孔底部钻穿、层压介厚超标、层压杂物、沉铜不良、填孔气泡和槽内杂物6类。根据可能存在的影响因素,对气泡、粉尘杂物和药水性能进行研究,提出合理的关键控制点,为HDI板填孔漏填改善提供有效的研究方向。Three common defects in the blind hole filling by copper plating process on high density interconnector(HDI)board,i.e.,missing filling,sag and cavity,are described.Failure analysis is conducted for the defect type of missing filling.Its failure forms can be sorted into six categories:blind hole bottom drilling,laminated medium thickness exceeding the standard,laminated debris,poor copper sedimentation,hole filling bubbles and debris in the groove.According to the possible influencing factors such as bubbles,dust and liquid properties,reasonable key control points are proposed.This study provides an effective research direction for the improvement of the missing filling of the HDI boards filling.

关 键 词：高密度互连(HDI)板 盲孔 镀铜填孔 漏填 

分 类 号：TN41[电子电信—微电子学与固体电子学]